Package warpage, interface delamination and thermal fatigue are the major reliability concerns for micro-electronic packages, caused by mismatch in thermal expansion together with residual stress originating from the curing process of the packaging polymers. To investigate the influence of the residual stress- and strain fields on the failure predictions and to optimise the product for reliability, cure-dependent viscoelastic constitutive relations for the applied polymers are required. The present paper gives an overview of recent progress in establishing such relations. A model moulding compound is used for cure dependent characterization and is subsequently used for QFN package moulding. The modelled and the experimentally obtained warpage have been compared.
Original languageUndefined/Unknown
Title of host publicationProceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
Editors sn
Place of PublicationAtlanta, GA, USA
PublisherIEEE Society
Pages23-27
Number of pages5
ISBN (Print)1-4244-0260-3
Publication statusPublished - 2006
Event2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces - Atlanta, GA, USA
Duration: 15 Mar 200617 Mar 2006

Publication series

Name
PublisherIEEE

Conference

Conference2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
Period15/03/0617/03/06

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 1486985