Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

P Liu; J Zhang; R Sokolovskij; HW van Zeijl; BAZ Mimoun; GQ Zhang

doi:10.1109/EuroSimE.2013.6529982

Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

P Liu, J Zhang, R Sokolovskij, HW van Zeijl, BAZ Mimoun, GQ Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	English
Title of host publication	Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)
Editors	GQ Zhang
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	1-6
Number of pages	6
ISBN (Print)	978-1-4673-6138-5
DOIs	https://doi.org/10.1109/EuroSimE.2013.6529982
Publication status	Published - 2013
Event	EuroSimE 2013 - Wroclaw, Poland Duration: 14 Apr 2013 → 17 Apr 2013

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2013
Country/Territory	Poland
City	Wroclaw
Period	14/04/13 → 17/04/13

Bibliographical note

Harvest

Access to Document

10.1109/EuroSimE.2013.6529982

Cite this

Liu, P., Zhang, J., Sokolovskij, R., van Zeijl, HW., Mimoun, BAZ., & Zhang, GQ. (2013). Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations. In GQ. Zhang (Ed.), Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013) (pp. 1-6). IEEE Society. https://doi.org/10.1109/EuroSimE.2013.6529982

Liu, P ; Zhang, J ; Sokolovskij, R et al. / Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations. Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). editor / GQ Zhang. Piscataway : IEEE Society, 2013. pp. 1-6

@inproceedings{58777ea01fa6425094916f7ac6c2d7a9,

title = "Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations",

author = "P Liu and J Zhang and R Sokolovskij and {van Zeijl}, HW and BAZ Mimoun and GQ Zhang",

note = "Harvest; EuroSimE 2013 ; Conference date: 14-04-2013 Through 17-04-2013",

year = "2013",

doi = "10.1109/EuroSimE.2013.6529982",

language = "English",

isbn = "978-1-4673-6138-5",

publisher = "IEEE Society",

pages = "1--6",

editor = "GQ Zhang",

booktitle = "Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)",

}

Liu, P, Zhang, J, Sokolovskij, R, van Zeijl, HW, Mimoun, BAZ & Zhang, GQ 2013, Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations. in GQ Zhang (ed.), Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). IEEE Society, Piscataway, pp. 1-6, EuroSimE 2013, Wroclaw, Poland, 14/04/13. https://doi.org/10.1109/EuroSimE.2013.6529982

Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations. / Liu, P; Zhang, J; Sokolovskij, R et al.
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). ed. / GQ Zhang. Piscataway: IEEE Society, 2013. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

AU - Liu, P

AU - Zhang, J

AU - Sokolovskij, R

AU - van Zeijl, HW

AU - Mimoun, BAZ

AU - Zhang, GQ

N1 - Harvest

PY - 2013

Y1 - 2013

U2 - 10.1109/EuroSimE.2013.6529982

DO - 10.1109/EuroSimE.2013.6529982

M3 - Conference contribution

SN - 978-1-4673-6138-5

SP - 1

EP - 6

BT - Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)

A2 - Zhang, GQ

PB - IEEE Society

CY - Piscataway

T2 - EuroSimE 2013

Y2 - 14 April 2013 through 17 April 2013

ER -

Liu P, Zhang J, Sokolovskij R, van Zeijl HW, Mimoun BAZ, Zhang GQ. Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations. In Zhang GQ, editor, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Piscataway: IEEE Society. 2013. p. 1-6 doi: 10.1109/EuroSimE.2013.6529982