Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages

Q Li; JFL Goosen; JTM van Beek; F van Keulen; KL Phan; B van Velzen; JJM Bontemps; JJ Koning; GQ Zhang

Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages

Q Li, JFL Goosen, JTM van Beek, F van Keulen, KL Phan, B van Velzen, JJM Bontemps, JJ Koning, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	International Conference on Electronics Packaging 2008
Editors	H Nishida
Place of Publication	Tokyo
Publisher	JIEP
Pages	220-225
Number of pages	6
Publication status	Published - 2008
Event	International Conference on Electronics Packaging 2008 - Tokyo Duration: 10 Jun 2008 → 12 Jun 2008

Publication series

Name
Publisher	JIEP

Conference

Conference	International Conference on Electronics Packaging 2008
Period	10/06/08 → 12/06/08

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{37ded99f6bcc40f7b3c496a7bf869dec,

title = "Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages",

keywords = "Conf.proc. > 3 pag",

author = "Q Li and JFL Goosen and {van Beek}, JTM and {van Keulen}, F and KL Phan and {van Velzen}, B and JJM Bontemps and JJ Koning and GQ Zhang",

year = "2008",

language = "Undefined/Unknown",

publisher = "JIEP",

pages = "220--225",

editor = "H Nishida",

booktitle = "International Conference on Electronics Packaging 2008",

note = "International Conference on Electronics Packaging 2008 ; Conference date: 10-06-2008 Through 12-06-2008",

}

Li, Q, Goosen, JFL, van Beek, JTM, van Keulen, F, Phan, KL, van Velzen, B, Bontemps, JJM, Koning, JJ & Zhang, GQ 2008, Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages. in H Nishida (ed.), International Conference on Electronics Packaging 2008. JIEP, Tokyo, pp. 220-225, International Conference on Electronics Packaging 2008, 10/06/08.

TY - GEN

T1 - Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages

AU - Li, Q

AU - Goosen, JFL

AU - van Beek, JTM

AU - van Keulen, F

AU - Phan, KL

AU - van Velzen, B

AU - Bontemps, JJM

AU - Koning, JJ

AU - Zhang, GQ

PY - 2008

Y1 - 2008

KW - Conf.proc. > 3 pag

UR - http://www.jiep.or.jp/icep/

M3 - Conference contribution

SP - 220

EP - 225

BT - International Conference on Electronics Packaging 2008

A2 - Nishida, H

PB - JIEP

CY - Tokyo

T2 - International Conference on Electronics Packaging 2008

Y2 - 10 June 2008 through 12 June 2008

ER -

Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages

Publication series

Conference

Keywords

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Cite this