@inproceedings{364f3bbcb83f4746af91ae25a33ae0c7,
title = "High aspect ratio lithography for litho-defined wire bonding",
author = "ZK Esfahani and {van Zeijl}, HW and GQ Zhang",
note = "Harvest; ECTC 2014, Orlando, FL, USA ; Conference date: 27-05-2014 Through 30-05-2014",
year = "2014",
doi = "10.1109/ECTC.2014.6897501",
language = "English",
isbn = "978-147992407-3",
publisher = "IEEE Society",
pages = "1556--1561",
editor = "W Sauter and A Huffman",
booktitle = "Proceedings - 64th Electronic Components and Technology Conference",
}