High aspect ratio spiral resonators for process variation investigation and MEMS applications

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

35 Downloads (Pure)

Abstract

In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the wafer was performed by using an optical measurement setup. Two laser beams were used where one is modulated by the periodic movement of the center mass of the resonator. One of the beams is reflected back from the modulated resonator and this beam hits a photo diode. Variations in light intensity due to movement of the resonator is providing a measurement signal correlated to movement. Preliminary measurements showed that measured eigenfrequencies are in correspondence with the simulations within a range of 0-10% deviation.

Original languageEnglish
Title of host publicationProceedings of IEEE Sensors Conference 2017
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages1-3
Number of pages3
ISBN (Electronic)978-1-5090-1012-7
ISBN (Print)978-1-5090-1013-4
DOIs
Publication statusPublished - 2017
EventIEEE SENSORS 2017 - Glasgow, United Kingdom
Duration: 29 Oct 20171 Nov 2017
http://ieee-sensors2017.org/

Conference

ConferenceIEEE SENSORS 2017
Country/TerritoryUnited Kingdom
CityGlasgow
Period29/10/171/11/17
Internet address

Bibliographical note

Accepted author manuscript

Keywords

  • bulk micromachining
  • DRIE etching
  • MEMS
  • process variations
  • Resonators

Fingerprint

Dive into the research topics of 'High aspect ratio spiral resonators for process variation investigation and MEMS applications'. Together they form a unique fingerprint.

Cite this