Abstract
In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the wafer was performed by using an optical measurement setup. Two laser beams were used where one is modulated by the periodic movement of the center mass of the resonator. One of the beams is reflected back from the modulated resonator and this beam hits a photo diode. Variations in light intensity due to movement of the resonator is providing a measurement signal correlated to movement. Preliminary measurements showed that measured eigenfrequencies are in correspondence with the simulations within a range of 0-10% deviation.
Original language | English |
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Title of host publication | Proceedings of IEEE Sensors Conference 2017 |
Place of Publication | Piscataway, NJ |
Publisher | IEEE |
Pages | 1-3 |
Number of pages | 3 |
ISBN (Electronic) | 978-1-5090-1012-7 |
ISBN (Print) | 978-1-5090-1013-4 |
DOIs | |
Publication status | Published - 2017 |
Event | IEEE SENSORS 2017 - Glasgow, United Kingdom Duration: 29 Oct 2017 → 1 Nov 2017 http://ieee-sensors2017.org/ |
Conference
Conference | IEEE SENSORS 2017 |
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Country/Territory | United Kingdom |
City | Glasgow |
Period | 29/10/17 → 1/11/17 |
Internet address |
Bibliographical note
Accepted author manuscriptKeywords
- bulk micromachining
- DRIE etching
- MEMS
- process variations
- Resonators