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High aspect ratio spiral resonators for process variation investigation and MEMS applications. / Middelburg, L.M.; Mansouri, B. El ; Van Zeijl, H.W.; Zhang, G.Q.; Poelma, R.H.

Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ : IEEE, 2017. p. 1-3.

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Middelburg, LM, Mansouri, BE, Van Zeijl, HW, Zhang, GQ & Poelma, RH 2017, High aspect ratio spiral resonators for process variation investigation and MEMS applications. in Proceedings of IEEE Sensors Conference 2017. IEEE, Piscataway, NJ, pp. 1-3, IEEE SENSORS 2017, Glasgow, United Kingdom, 29/10/17. https://doi.org/10.1109/ICSENS.2017.8233945

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@inproceedings{39a87fe91aa543f3addf7535fc659b4d,
title = "High aspect ratio spiral resonators for process variation investigation and MEMS applications",
abstract = "In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the wafer was performed by using an optical measurement setup. Two laser beams were used where one is modulated by the periodic movement of the center mass of the resonator. One of the beams is reflected back from the modulated resonator and this beam hits a photo diode. Variations in light intensity due to movement of the resonator is providing a measurement signal correlated to movement. Preliminary measurements showed that measured eigenfrequencies are in correspondence with the simulations within a range of 0-10% deviation.",
keywords = "bulk micromachining, DRIE etching, MEMS, process variations, Resonators",
author = "L.M. Middelburg and Mansouri, {B. El} and {Van Zeijl}, H.W. and G.Q. Zhang and R.H. Poelma",
note = "Accepted author manuscript; IEEE SENSORS 2017 ; Conference date: 29-10-2017 Through 01-11-2017",
year = "2017",
doi = "10.1109/ICSENS.2017.8233945",
language = "English",
isbn = "978-1-5090-1013-4",
pages = "1--3",
booktitle = "Proceedings of IEEE Sensors Conference 2017",
publisher = "IEEE",
address = "United States",
url = "http://ieee-sensors2017.org/",

}

RIS

TY - GEN

T1 - High aspect ratio spiral resonators for process variation investigation and MEMS applications

AU - Middelburg, L.M.

AU - Mansouri, B. El

AU - Van Zeijl, H.W.

AU - Zhang, G.Q.

AU - Poelma, R.H.

N1 - Accepted author manuscript

PY - 2017

Y1 - 2017

N2 - In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the wafer was performed by using an optical measurement setup. Two laser beams were used where one is modulated by the periodic movement of the center mass of the resonator. One of the beams is reflected back from the modulated resonator and this beam hits a photo diode. Variations in light intensity due to movement of the resonator is providing a measurement signal correlated to movement. Preliminary measurements showed that measured eigenfrequencies are in correspondence with the simulations within a range of 0-10% deviation.

AB - In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the wafer was performed by using an optical measurement setup. Two laser beams were used where one is modulated by the periodic movement of the center mass of the resonator. One of the beams is reflected back from the modulated resonator and this beam hits a photo diode. Variations in light intensity due to movement of the resonator is providing a measurement signal correlated to movement. Preliminary measurements showed that measured eigenfrequencies are in correspondence with the simulations within a range of 0-10% deviation.

KW - bulk micromachining

KW - DRIE etching

KW - MEMS

KW - process variations

KW - Resonators

UR - http://www.scopus.com/inward/record.url?scp=85044319485&partnerID=8YFLogxK

U2 - 10.1109/ICSENS.2017.8233945

DO - 10.1109/ICSENS.2017.8233945

M3 - Conference contribution

AN - SCOPUS:85044319485

SN - 978-1-5090-1013-4

SP - 1

EP - 3

BT - Proceedings of IEEE Sensors Conference 2017

PB - IEEE

CY - Piscataway, NJ

T2 - IEEE SENSORS 2017

Y2 - 29 October 2017 through 1 November 2017

ER -

ID: 44904112