Standard

High temperature storage influence on molding compound properties. / de Vreugd, J; Jansen, KMB; Ernst, LJ; Bohm, C; Pufall, R.

Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. ed. / Ernst, LJ; Zhang, GQ; Driel, WD van; Rodgers, P; Bailey, C; Saint Leger, O. de. IEEE Society, 2010. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Harvard

de Vreugd, J, Jansen, KMB, Ernst, LJ, Bohm, C & Pufall, R 2010, High temperature storage influence on molding compound properties. in Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O. de (eds), Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. IEEE Society, pp. 1-6, EuroSimE 2010 , Bordeaux, France, 25/04/10.

APA

de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C., & Pufall, R. (2010). High temperature storage influence on molding compound properties. In Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, & Saint Leger, O. de (Eds.), Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France (pp. 1-6). IEEE Society.

Vancouver

de Vreugd J, Jansen KMB, Ernst LJ, Bohm C, Pufall R. High temperature storage influence on molding compound properties. In Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, Saint Leger, O. de, editors, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. IEEE Society. 2010. p. 1-6

Author

de Vreugd, J ; Jansen, KMB ; Ernst, LJ ; Bohm, C ; Pufall, R. / High temperature storage influence on molding compound properties. Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. editor / Ernst, LJ ; Zhang, GQ ; Driel, WD van ; Rodgers, P ; Bailey, C ; Saint Leger, O. de. IEEE Society, 2010. pp. 1-6

BibTeX

@inproceedings{497f0b3fe8d84de0b3377090083606f6,
title = "High temperature storage influence on molding compound properties",
abstract = "An electronic device cannot perform its designed functions until it is packaged such that it is interconnected with the rest of the system and protected. As an encapsulation material, thermosetting polymers are widely used. It is well known that properties of polymerbased composites like molding compounds are highly affected by the influence of temperature, relative humidity and degree of conversion. The effect of above mentioned internal and external circumstances are investigated extensively in the past. Surprisingly the effect of high temperature storage on the mechanical properties is scarcely studied. From literatures research it is concluded that high temperature storage and postcure treatments increases the glass transition temperature. Also a weight loss during high temperature storage is reported [1], [2]. Since thermal treatments are very common in micro electronic industry, it is relevant to understand in more detail the influence of thermal aging on the mechanical properties of molding compounds. In this research the effect of postcure and thermal aging on the mechanical properties of molding compounds is systematically studied. It turns out that postcure and thermal aging cause a broadening of the viscoelastic region, an increase in Tg, and increase in rubbery modulus and ongoing shrinkage of the molding compound. It is concluded that the change in properties can be attributed to a reaction of the molding compound with oxygen. This paper presents the observed change in properties caused by oxidation.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "{de Vreugd}, J and KMB Jansen and LJ Ernst and C Bohm and R Pufall",
year = "2010",
language = "English",
isbn = "978-1-4244-7025-9",
pages = "1--6",
editor = "{Ernst, LJ} and {Zhang, GQ} and {Driel, WD van} and {Rodgers, P} and {Bailey, C} and {Saint Leger, O. de}",
booktitle = "Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France",
publisher = "IEEE Society",

}

RIS

TY - GEN

T1 - High temperature storage influence on molding compound properties

AU - de Vreugd, J

AU - Jansen, KMB

AU - Ernst, LJ

AU - Bohm, C

AU - Pufall, R

PY - 2010

Y1 - 2010

N2 - An electronic device cannot perform its designed functions until it is packaged such that it is interconnected with the rest of the system and protected. As an encapsulation material, thermosetting polymers are widely used. It is well known that properties of polymerbased composites like molding compounds are highly affected by the influence of temperature, relative humidity and degree of conversion. The effect of above mentioned internal and external circumstances are investigated extensively in the past. Surprisingly the effect of high temperature storage on the mechanical properties is scarcely studied. From literatures research it is concluded that high temperature storage and postcure treatments increases the glass transition temperature. Also a weight loss during high temperature storage is reported [1], [2]. Since thermal treatments are very common in micro electronic industry, it is relevant to understand in more detail the influence of thermal aging on the mechanical properties of molding compounds. In this research the effect of postcure and thermal aging on the mechanical properties of molding compounds is systematically studied. It turns out that postcure and thermal aging cause a broadening of the viscoelastic region, an increase in Tg, and increase in rubbery modulus and ongoing shrinkage of the molding compound. It is concluded that the change in properties can be attributed to a reaction of the molding compound with oxygen. This paper presents the observed change in properties caused by oxidation.

AB - An electronic device cannot perform its designed functions until it is packaged such that it is interconnected with the rest of the system and protected. As an encapsulation material, thermosetting polymers are widely used. It is well known that properties of polymerbased composites like molding compounds are highly affected by the influence of temperature, relative humidity and degree of conversion. The effect of above mentioned internal and external circumstances are investigated extensively in the past. Surprisingly the effect of high temperature storage on the mechanical properties is scarcely studied. From literatures research it is concluded that high temperature storage and postcure treatments increases the glass transition temperature. Also a weight loss during high temperature storage is reported [1], [2]. Since thermal treatments are very common in micro electronic industry, it is relevant to understand in more detail the influence of thermal aging on the mechanical properties of molding compounds. In this research the effect of postcure and thermal aging on the mechanical properties of molding compounds is systematically studied. It turns out that postcure and thermal aging cause a broadening of the viscoelastic region, an increase in Tg, and increase in rubbery modulus and ongoing shrinkage of the molding compound. It is concluded that the change in properties can be attributed to a reaction of the molding compound with oxygen. This paper presents the observed change in properties caused by oxidation.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-7025-9

SP - 1

EP - 6

BT - Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France

A2 - Ernst, LJ, null

A2 - Zhang, GQ, null

A2 - Driel, WD van, null

A2 - Rodgers, P, null

A2 - Bailey, C, null

A2 - Saint Leger, O. de, null

PB - IEEE Society

ER -

ID: 2948698