Impact of mid-bond testing in 3D stacked ICs

M Taouil, S Hamdioui, EJ Marinissen, S Bhawmik

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	English
Title of host publication	16th IEEE Symposium on defect and fault tolerance in VLSI and nanotechnology systems
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	1-6
Number of pages	6
Publication status	Published - 2013
Event	DFT 2013 - Piscataway Duration: 2 Oct 2013 → 4 Oct 2013

Name
Publisher	IEEE

Conference	DFT 2013
Period	2/10/13 → 4/10/13

Cite this

@inproceedings{a72a1ea6e8b7425988da42c9397386c1,

title = "Impact of mid-bond testing in 3D stacked ICs",

author = "M Taouil and S Hamdioui and EJ Marinissen and S Bhawmik",

year = "2013",

language = "English",

publisher = "IEEE Society",

pages = "1--6",

editor = "s.n.",

booktitle = "16th IEEE Symposium on defect and fault tolerance in VLSI and nanotechnology systems",

note = "DFT 2013 ; Conference date: 02-10-2013 Through 04-10-2013",

}

TY - GEN

T1 - Impact of mid-bond testing in 3D stacked ICs

AU - Taouil, M

AU - Hamdioui, S

AU - Marinissen, EJ

AU - Bhawmik, S

PY - 2013

Y1 - 2013

UR - http://ce-publications.et.tudelft.nl/publications/1389_impact_of_midbond_testing_in_3d_stacked_ics.pdf

M3 - Conference contribution

SP - 1

EP - 6

BT - 16th IEEE Symposium on defect and fault tolerance in VLSI and nanotechnology systems

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

T2 - DFT 2013

Y2 - 2 October 2013 through 4 October 2013

ER -