Influence of visco-elasticity of low-k dielectrics on thermo-mechanical behavior of dual damascene process

V Gonda; GQ Zhang; J den Toonder; J Beijer; LJ Ernst

Influence of visco-elasticity of low-k dielectrics on thermo-mechanical behavior of dual damascene process

V Gonda, GQ Zhang, J den Toonder, J Beijer, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	Undefined/Unknown
Title of host publication	ICEPT 2003
Editors	K Bi, PG Barnwell, J Wang
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	288-293
Number of pages	6
ISBN (Print)	0-7803-8168-8
Publication status	Published - 2003
Event	5th international conference on electronic packaging technology, Shanghai - Piscataway Duration: 28 Oct 2003 → 30 Oct 2003

Publication series

Name
Publisher	IEEE

Conference

Conference	5th international conference on electronic packaging technology, Shanghai
Period	28/10/03 → 30/10/03

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{f63ee46f56a7479f9bdbe9b3c07e105c,

title = "Influence of visco-elasticity of low-k dielectrics on thermo-mechanical behavior of dual damascene process",

keywords = "Conf.proc. > 3 pag",

author = "V Gonda and GQ Zhang and {den Toonder}, J and J Beijer and LJ Ernst",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-8168-8",

publisher = "IEEE Society",

pages = "288--293",

editor = "K Bi and PG Barnwell and J Wang",

booktitle = "ICEPT 2003",

note = "5th international conference on electronic packaging technology, Shanghai ; Conference date: 28-10-2003 Through 30-10-2003",

}

TY - GEN

T1 - Influence of visco-elasticity of low-k dielectrics on thermo-mechanical behavior of dual damascene process

AU - Gonda, V

AU - Zhang, GQ

AU - den Toonder, J

AU - Beijer, J

AU - Ernst, LJ

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8168-8

SP - 288

EP - 293

BT - ICEPT 2003

A2 - Bi, K

A2 - Barnwell, PG

A2 - Wang, J

PB - IEEE Society

CY - Piscataway

T2 - 5th international conference on electronic packaging technology, Shanghai

Y2 - 28 October 2003 through 30 October 2003

ER -