Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module

H Tang; Y Yu; M Jia; SYY Leung; C Qian; CCA Yuan; X Zhou; GQ Zhang

doi:10.1109/ICEPT.2014.6922858

Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module

H Tang, Y Yu, M Jia, SYY Leung, C Qian, CCA Yuan, X Zhou, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of the 15th International Conference on Electronic Packaging Technology
Editors	K Bi, Z Tian, Z Xu
Place of Publication	Piscatawa, NJ, USA
Publisher	IEEE Society
Pages	1198-1201
Number of pages	4
ISBN (Print)	978-147994707-2
DOIs	https://doi.org/10.1109/ICEPT.2014.6922858
Publication status	Published - 2014
Event	ICEPT 2014, Chengdu, China - Piscatawa, NJ, USA Duration: 12 Aug 2014 → 15 Aug 2014

Publication series

Name
Publisher	IEEE

Conference

Conference	ICEPT 2014, Chengdu, China
Period	12/08/14 → 15/08/14

Bibliographical note

Harvest

Access to Document

10.1109/ICEPT.2014.6922858

Cite this

Tang, H., Yu, Y., Jia, M., Leung, SYY., Qian, C., Yuan, CCA., Zhou, X., & Zhang, GQ. (2014). Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module. In K. Bi, Z. Tian, & Z. Xu (Eds.), Proceedings of the 15th International Conference on Electronic Packaging Technology (pp. 1198-1201). IEEE Society. https://doi.org/10.1109/ICEPT.2014.6922858

@inproceedings{52af29d692794667ad9981d52f5e5d67,

title = "Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module",

author = "H Tang and Y Yu and M Jia and SYY Leung and C Qian and CCA Yuan and X Zhou and GQ Zhang",

note = "Harvest; ICEPT 2014, Chengdu, China ; Conference date: 12-08-2014 Through 15-08-2014",

year = "2014",

doi = "10.1109/ICEPT.2014.6922858",

language = "English",

isbn = "978-147994707-2",

publisher = "IEEE Society",

pages = "1198--1201",

editor = "K Bi and Z Tian and Z Xu",

booktitle = "Proceedings of the 15th International Conference on Electronic Packaging Technology",

}

Tang, H, Yu, Y, Jia, M, Leung, SYY, Qian, C, Yuan, CCA, Zhou, X & Zhang, GQ 2014, Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module. in K Bi, Z Tian & Z Xu (eds), Proceedings of the 15th International Conference on Electronic Packaging Technology. IEEE Society, Piscatawa, NJ, USA, pp. 1198-1201, ICEPT 2014, Chengdu, China, 12/08/14. https://doi.org/10.1109/ICEPT.2014.6922858

Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module. / Tang, H; Yu, Y; Jia, M et al.
Proceedings of the 15th International Conference on Electronic Packaging Technology. ed. / K Bi; Z Tian; Z Xu. Piscatawa, NJ, USA: IEEE Society, 2014. p. 1198-1201.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module

AU - Tang, H

AU - Yu, Y

AU - Jia, M

AU - Leung, SYY

AU - Qian, C

AU - Yuan, CCA

AU - Zhou, X

AU - Zhang, GQ

N1 - Harvest

PY - 2014

Y1 - 2014

U2 - 10.1109/ICEPT.2014.6922858

DO - 10.1109/ICEPT.2014.6922858

M3 - Conference contribution

SN - 978-147994707-2

SP - 1198

EP - 1201

BT - Proceedings of the 15th International Conference on Electronic Packaging Technology

A2 - Bi, K

A2 - Tian, Z

A2 - Xu, Z

PB - IEEE Society

CY - Piscatawa, NJ, USA

T2 - ICEPT 2014, Chengdu, China

Y2 - 12 August 2014 through 15 August 2014

ER -

Tang H, Yu Y, Jia M, Leung SYY, Qian C, Yuan CCA et al. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module. In Bi K, Tian Z, Xu Z, editors, Proceedings of the 15th International Conference on Electronic Packaging Technology. Piscatawa, NJ, USA: IEEE Society. 2014. p. 1198-1201 doi: 10.1109/ICEPT.2014.6922858