Innovative thermo-mechanical design and qualification of microelectronics - the challenges for mechanical professionals

G.Q. Zhang, P Maessen, J Bisschop, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Original languageUndefined/Unknown
Title of host publicationProceedings of the fourth international symposium on electronic packaging technology, August 8-11
Editors K Bi, et al
Place of Publications.l.
PublisherIEEE Society
Pages314-318
Number of pages5
ISBN (Print)0-7803-9811-4
Publication statusPublished - 2001
EventISEPT '2001, Beijng - s.l.
Duration: 8 Aug 200111 Aug 2001

Publication series

Name
PublisherIEEE

Conference

ConferenceISEPT '2001, Beijng
Period8/08/0111/08/01

Keywords

  • ZX Int.klas.verslagjaar < 2002

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