• G Schlottig
  • A Xiao
  • H Pape
  • B Wunderle
  • LJ Ernst
As we face higher numbers of material layers in the increasingly complex Microsystems, the rating of layers reliability has to keep pace. Fracture mechanical descriptions are a big qualitative improvement when using simulation for design and reliability support, especially when looking at layer delamination. In order to simulate the interfacial fracture we urgently need to find empirical parameters, because the fracture parameters have to be verified as critical. Such experiments are difficult to carry out at the Silicon-to-Epoxy Molding Compound (EMC) interface. We are now able to do such investigations using the Mixed Mode Chisel (MMC) setup. In this paper we compare results of the Silicon-EMC interface for the in- and exclusion of thermal residual stresses in the simulations. The interface specimens are of package scale and are derived from the embedded wafer level molding process. We find the impact of thermal residual stresses crucial for the validity of fracture toughness values, and show relations to consider when using the MMC setup. We do not find any EMC residuals on the delaminated Silicon surface.
Original languageEnglish
Title of host publicationProceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France
Editors Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, Saint Leger, O de
Place of PublicationBordeaux, France
PublisherIEEE Society
Pages1-5
Number of pages5
ISBN (Print)978-1-4244-7025-9
Publication statusPublished - 2010
EventEuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems - Bordeaux, Frankrijk, Bordeaux, France
Duration: 25 Apr 201028 Apr 2010
Conference number: 11

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2010 
CountryFrance
CityBordeaux
Period25/04/1028/04/10

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 3576084