Standard

Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor. / Prisacaru, Alexandra; Sun, Yue; Gromala, Przemyslaw Jakub; Han, Bongtae; Zhang, Guo Qi.

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ : IEEE, 2018. p. 1-3.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Prisacaru, A, Sun, Y, Gromala, PJ, Han, B & Zhang, GQ 2018, Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor. in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. IEEE, Piscataway, NJ, pp. 1-3, EuroSimE 2018, Toulouse, France, 15/04/18. https://doi.org/10.1109/EuroSimE.2018.8369955

APA

Prisacaru, A., Sun, Y., Gromala, P. J., Han, B., & Zhang, G. Q. (2018). Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor. In 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018 (pp. 1-3). Piscataway, NJ: IEEE. https://doi.org/10.1109/EuroSimE.2018.8369955

Vancouver

Prisacaru A, Sun Y, Gromala PJ, Han B, Zhang GQ. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor. In 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE. 2018. p. 1-3 https://doi.org/10.1109/EuroSimE.2018.8369955

Author

Prisacaru, Alexandra ; Sun, Yue ; Gromala, Przemyslaw Jakub ; Han, Bongtae ; Zhang, Guo Qi. / Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ : IEEE, 2018. pp. 1-3

BibTeX

@inproceedings{867f42dc1b9b4b1d91b75aa9d4e68c69,
title = "Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor",
abstract = "As autonomous driving is becoming reality, more advanced solutions to enhance reliability of safety relevant systems are demanded. One of such solutions is to consolidate prognostics and health management concepts. It can be accomplished by understanding the failure, recognizing it from the field signals, and eventually predicting it. This study focuses on the second step, namely recognizing the failure from sensor signals. The test vehicle used in the study is a Thin Quad Flat Package (TQFP) mounted on a printed circuit board (PCB). The package contains 8 piezoresistive stress sensors which replaces the functional die. The test vehicle is subjected to liquid thermal shock testing conditions, and the stress state changes inside the package are recorded by stress sensors. Each sensor contains 60 stress-measuring cells, which provides the internal stress state of the package with high resolution and accuracy. The internal stress state is used to identify the failure times and locations.",
keywords = "Stress, Liquids, Electric shock, Compounds, Delamination, Reliability, Piezoresistance",
author = "Alexandra Prisacaru and Yue Sun and Gromala, {Przemyslaw Jakub} and Bongtae Han and Zhang, {Guo Qi}",
year = "2018",
doi = "10.1109/EuroSimE.2018.8369955",
language = "English",
pages = "1--3",
booktitle = "2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018",
publisher = "IEEE",
address = "United States",

}

RIS

TY - GEN

T1 - Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

AU - Prisacaru, Alexandra

AU - Sun, Yue

AU - Gromala, Przemyslaw Jakub

AU - Han, Bongtae

AU - Zhang, Guo Qi

PY - 2018

Y1 - 2018

N2 - As autonomous driving is becoming reality, more advanced solutions to enhance reliability of safety relevant systems are demanded. One of such solutions is to consolidate prognostics and health management concepts. It can be accomplished by understanding the failure, recognizing it from the field signals, and eventually predicting it. This study focuses on the second step, namely recognizing the failure from sensor signals. The test vehicle used in the study is a Thin Quad Flat Package (TQFP) mounted on a printed circuit board (PCB). The package contains 8 piezoresistive stress sensors which replaces the functional die. The test vehicle is subjected to liquid thermal shock testing conditions, and the stress state changes inside the package are recorded by stress sensors. Each sensor contains 60 stress-measuring cells, which provides the internal stress state of the package with high resolution and accuracy. The internal stress state is used to identify the failure times and locations.

AB - As autonomous driving is becoming reality, more advanced solutions to enhance reliability of safety relevant systems are demanded. One of such solutions is to consolidate prognostics and health management concepts. It can be accomplished by understanding the failure, recognizing it from the field signals, and eventually predicting it. This study focuses on the second step, namely recognizing the failure from sensor signals. The test vehicle used in the study is a Thin Quad Flat Package (TQFP) mounted on a printed circuit board (PCB). The package contains 8 piezoresistive stress sensors which replaces the functional die. The test vehicle is subjected to liquid thermal shock testing conditions, and the stress state changes inside the package are recorded by stress sensors. Each sensor contains 60 stress-measuring cells, which provides the internal stress state of the package with high resolution and accuracy. The internal stress state is used to identify the failure times and locations.

KW - Stress

KW - Liquids

KW - Electric shock

KW - Compounds

KW - Delamination

KW - Reliability

KW - Piezoresistance

UR - http://www.scopus.com/inward/record.url?scp=85048853885&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE.2018.8369955

DO - 10.1109/EuroSimE.2018.8369955

M3 - Conference contribution

SP - 1

EP - 3

BT - 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018

PB - IEEE

CY - Piscataway, NJ

ER -

ID: 45595833