Is 3D integration the way to future dependable computing platforms?

S Safiruddin; DV Borodin; M Lefter; GR Voicu; SD Cotofana

Is 3D integration the way to future dependable computing platforms?

S Safiruddin, DV Borodin, M Lefter, GR Voicu, SD Cotofana

Computer Engineering

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

6 Citations (Scopus)

Original language	English
Title of host publication	3th International conference on optimization of electrical and electronic equipment
Editors	s.n.
Place of Publication	New York
Publisher	IEEE Society
Pages	1-10
Number of pages	10
ISBN (Print)	978-1-4673-1653-8
Publication status	Published - 2012
Event	OPTIM 2012 - New York Duration: 24 May 2012 → 26 May 2012

Publication series

Name
Publisher	IEEE

Conference

Conference	OPTIM 2012
Period	24/05/12 → 26/05/12

Cite this

@inproceedings{38eba890cff34ac4abc7ef336514a4b9,

title = "Is 3D integration the way to future dependable computing platforms?",

author = "S Safiruddin and DV Borodin and M Lefter and GR Voicu and SD Cotofana",

year = "2012",

language = "English",

isbn = "978-1-4673-1653-8",

publisher = "IEEE Society",

pages = "1--10",

editor = "s.n.",

booktitle = "3th International conference on optimization of electrical and electronic equipment",

note = "OPTIM 2012 ; Conference date: 24-05-2012 Through 26-05-2012",

}

Is 3D integration the way to future dependable computing platforms? / Safiruddin, S; Borodin, DV; Lefter, M et al.
3th International conference on optimization of electrical and electronic equipment. ed. / s.n. New York: IEEE Society, 2012. p. 1-10.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review