• Jiajie Fan
  • Lei Li
  • Cheng Qian
  • Aihua Hu
  • Xuejun Fan
  • Guoqi Zhang

With the popularity and widespread application of high-power light-emitting diode (LED) in lighting industry, its reliability has gradually become one of research focuses.The failure of gold bonding wires in the traditional LED package has been a critical bottleneck that restricts its reliability. In this paper, the failure mechanism of LED under cyclically electrical loading is firstly identified through both gold bonding wire mechanical simulation and power cycling test experiment, which is the fatigue fracture of gold bonding wire. Then, two lifetime prediction methods, the acceleration factor extraction method based on current acceleration model and the strain-based Coffin-Manson analytical method, are established and verified with experimental results. The results show that the lifetime prediction accuracy of the proposed methods is high and they can achieve a fast and accurate reliability assessment for high-power LEDs with wire-bonding packaging technology.

Translated title of the contributionFatigue fracture lifetime prediction for gold bonding wires of high-power LED under cyclically electrical loading
Original languageChinese
Pages (from-to)478-485
Number of pages8
JournalBeijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics
Volume45
Issue number3
DOIs
Publication statusPublished - 2019

    Research areas

  • Fatigue fracture, Gold bonding wires, High-power light-emitting diode (LED), Lifetime prediction, Reliability

ID: 53837601