Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process

Zhou Jing*, Mesfin Seid Ibrahim, Jiajie Fan, Xuejun Fan, Guoqi Zhang

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

6 Citations (Scopus)

Abstract

The estimation of lifetime for highly reliable products including Ultraviolet Light-emitting Diodes (UV LEDs) has been challenging based on traditional lifetime tests that records time to failure. Recently constant stress and step stress degradation tests are used to gather degradation path data and modeling the degradation of performance characteristics has been applied. In this paper, a step stress accelerated degradation test (SSADT) designed to capture the degradation path and study the lifetime of UV LEDs. The radiation power degradation path was analyzed based on the IES TM-21 least square regression (LSR) and Wiener process approach. With its advantage of requiring smaller sample size and shorter test time, the SSADT provides a degradation path suitable for the proposed Wiener process modeling. The lifetime estimation for UV LEDs based on the proposed wiener process approach shows better prediction accuracy compared to the TM-21 LSR approach. By using this method, dynamic changes and degradation of the UV LEDs can be easily studied, and it can effectively estimate their remaining useful lifetimes.

Original languageEnglish
Title of host publication2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
PublisherIEEE
Pages1-8
Number of pages8
ISBN (Electronic)978-1-5386-8040-7
ISBN (Print)978-1-5386-8041-4
DOIs
Publication statusPublished - 1 Mar 2019
Event20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Hannover, Germany
Duration: 24 Mar 201927 Mar 2019
Conference number: 20th

Conference

Conference20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Country/TerritoryGermany
CityHannover
Period24/03/1927/03/19

Keywords

  • Degradation modeling
  • Radiation power degradation, Accelerated step stress test
  • Ultraviolet Light-emitting diodes
  • Wiener process

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