Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

8 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proc. IEEE Sensors 2007 Conference
Editors	B Mizaikoff, PJ French
Place of Publication	Atlanta, Georgia
Publisher	IEEE Society
Pages	974-977
Number of pages	4
ISBN (Print)	1-4244-1262-5
Publication status	Published - 2007

Name
Publisher	IEEE

Keywords

@inproceedings{8c5e2f994e7c4f33825b2dafd63e0e4b,

title = "Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Saadaoui and WHA Wien and {van Zeijl}, HW and H Schellevis and M Laros and PM Sarro",

year = "2007",

language = "Undefined/Unknown",

isbn = "1-4244-1262-5",

publisher = "IEEE Society",

pages = "974--977",

editor = "B Mizaikoff and PJ French",

booktitle = "Proc. IEEE Sensors 2007 Conference",

}

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

AU - Saadaoui, M

AU - Wien, WHA

AU - van Zeijl, HW

AU - Schellevis, H

AU - Laros, M

AU - Sarro, PM

PY - 2007

Y1 - 2007

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-1262-5

SP - 974

EP - 977

BT - Proc. IEEE Sensors 2007 Conference

A2 - Mizaikoff, B

A2 - French, PJ

PB - IEEE Society

CY - Atlanta, Georgia

ER -