Low temperature hybrid wafer bonding for 3D integration

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1 Citation (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)
EditorsGQ Zhang
Place of PublicationPiscataway, NJ
PublisherIEEE Society
Pages1-5
Number of pages5
ISBN (Print)978-1-4673-6138-5
DOIs
Publication statusPublished - 2013
EventEuroSimE 2013 - Wroclaw, Poland
Duration: 14 Apr 201317 Apr 2013

Conference

ConferenceEuroSimE 2013
Country/TerritoryPoland
CityWroclaw
Period14/04/1317/04/13

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