@inproceedings{60f9427a5ca24b9687f546d602e93cdc,
title = "Low temperature hybrid wafer bonding for 3D integration",
author = "AA Damian and RH Poelma and {van Zeijl}, HW and GQ Zhang",
year = "2013",
doi = "10.1109/EuroSimE.2013.6529968",
language = "English",
isbn = "978-1-4673-6138-5",
pages = "1--5",
editor = "GQ Zhang",
booktitle = "Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)",
publisher = "IEEE Society",
note = "EuroSimE 2013 ; Conference date: 14-04-2013 Through 17-04-2013",
}