Low-cost epoxy packaging of CMOS Hall-effect compasses (U-SP-2-I-ICT)

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	English
Title of host publication	Low-cost epoxy packaging of CMOS Hall-effect compasses
Place of Publication	Irvine,CA,USA.
Publisher	IEEE Society
Pages	65-68
Number of pages	4
Publication status	Published - 2005
Event	IEEE Sensors 2005 - Irvine, California, USA Duration: 31 Oct 2005 → 3 Nov 2005

Conference	IEEE Sensors 2005
Period	31/10/05 → 3/11/05

Keywords

@inproceedings{a9394cb7895d4afbb4513ffd33c152da,

title = "Low-cost epoxy packaging of CMOS Hall-effect compasses (U-SP-2-I-ICT)",

keywords = "professional journal papers, Conf.proc. > 3 pag",

author = "{van der Meer}, J and KAA Makinwa and JH Huijsing and FR Riedijk and {van Kampen}, EJ",

year = "2005",

language = "English",

pages = "65--68",

booktitle = "Low-cost epoxy packaging of CMOS Hall-effect compasses",

publisher = "IEEE Society",

note = "IEEE Sensors 2005 ; Conference date: 31-10-2005 Through 03-11-2005",

}

TY - GEN

T1 - Low-cost epoxy packaging of CMOS Hall-effect compasses (U-SP-2-I-ICT)

AU - van der Meer, J

AU - Makinwa, KAA

AU - Huijsing, JH

AU - Riedijk, FR

AU - van Kampen, EJ

PY - 2005

Y1 - 2005

KW - professional journal papers

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 65

EP - 68

BT - Low-cost epoxy packaging of CMOS Hall-effect compasses

PB - IEEE Society

CY - Irvine,CA,USA.

T2 - IEEE Sensors 2005

Y2 - 31 October 2005 through 3 November 2005

ER -