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Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices. / Dubois, Valentin; Raja, Shyamprasad N.; Gehring, Pascal; Caneva, Sabina; van der Zant, Herre S.J.; Niklaus, Frank; Stemme, Göran.

In: Nature Communications, Vol. 9, No. 1, 3433, 2018.

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Dubois, Valentin ; Raja, Shyamprasad N. ; Gehring, Pascal ; Caneva, Sabina ; van der Zant, Herre S.J. ; Niklaus, Frank ; Stemme, Göran. / Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices. In: Nature Communications. 2018 ; Vol. 9, No. 1.

BibTeX

@article{738a648407c34fcd98649a94996f5607,
title = "Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices",
abstract = "Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics. However, the fabrication of break junctions remains notoriously time-consuming and difficult to parallelize. Here we demonstrate true parallel fabrication of gold break junctions featuring sub-3 nm gaps on the wafer-scale, by relying on a novel self-breaking mechanism based on controlled crack formation in notched bridge structures. We achieve fabrication densities as high as 7 million junctions per cm2, with fabrication yields of around 7{\%} for obtaining crack-defined break junctions with sub-3 nm gaps of fixed gap width that exhibit electron tunneling. We also form molecular junctions using dithiol-terminated oligo(phenylene ethynylene) (OPE3) to demonstrate the feasibility of our approach for electrical probing of molecules down to liquid helium temperatures. Our technology opens a whole new range of experimental opportunities for nano and molecular electronics applications, by enabling very large-scale fabrication of solid-state break junctions.",
author = "Valentin Dubois and Raja, {Shyamprasad N.} and Pascal Gehring and Sabina Caneva and {van der Zant}, {Herre S.J.} and Frank Niklaus and G{\"o}ran Stemme",
year = "2018",
doi = "10.1038/s41467-018-05785-2",
language = "English",
volume = "9",
journal = "Nature Communications",
issn = "2041-1723",
publisher = "Nature Publishing Group",
number = "1",

}

RIS

TY - JOUR

T1 - Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

AU - Dubois, Valentin

AU - Raja, Shyamprasad N.

AU - Gehring, Pascal

AU - Caneva, Sabina

AU - van der Zant, Herre S.J.

AU - Niklaus, Frank

AU - Stemme, Göran

PY - 2018

Y1 - 2018

N2 - Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics. However, the fabrication of break junctions remains notoriously time-consuming and difficult to parallelize. Here we demonstrate true parallel fabrication of gold break junctions featuring sub-3 nm gaps on the wafer-scale, by relying on a novel self-breaking mechanism based on controlled crack formation in notched bridge structures. We achieve fabrication densities as high as 7 million junctions per cm2, with fabrication yields of around 7% for obtaining crack-defined break junctions with sub-3 nm gaps of fixed gap width that exhibit electron tunneling. We also form molecular junctions using dithiol-terminated oligo(phenylene ethynylene) (OPE3) to demonstrate the feasibility of our approach for electrical probing of molecules down to liquid helium temperatures. Our technology opens a whole new range of experimental opportunities for nano and molecular electronics applications, by enabling very large-scale fabrication of solid-state break junctions.

AB - Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics. However, the fabrication of break junctions remains notoriously time-consuming and difficult to parallelize. Here we demonstrate true parallel fabrication of gold break junctions featuring sub-3 nm gaps on the wafer-scale, by relying on a novel self-breaking mechanism based on controlled crack formation in notched bridge structures. We achieve fabrication densities as high as 7 million junctions per cm2, with fabrication yields of around 7% for obtaining crack-defined break junctions with sub-3 nm gaps of fixed gap width that exhibit electron tunneling. We also form molecular junctions using dithiol-terminated oligo(phenylene ethynylene) (OPE3) to demonstrate the feasibility of our approach for electrical probing of molecules down to liquid helium temperatures. Our technology opens a whole new range of experimental opportunities for nano and molecular electronics applications, by enabling very large-scale fabrication of solid-state break junctions.

UR - http://resolver.tudelft.nl/uuid:738a6484-07c3-4fcd-9864-9a94996f5607

UR - http://www.scopus.com/inward/record.url?scp=85052211020&partnerID=8YFLogxK

U2 - 10.1038/s41467-018-05785-2

DO - 10.1038/s41467-018-05785-2

M3 - Article

VL - 9

JO - Nature Communications

T2 - Nature Communications

JF - Nature Communications

SN - 2041-1723

IS - 1

M1 - 3433

ER -

ID: 46748102