@inproceedings{231e07432c084b60a60ca66c6306f6dc,
title = "Measuring and modeling the cure-dependent rubbery moduli of epoxy molding compound",
keywords = "Conf.proc. > 3 pag",
author = "DG Yang and KMB Jansen and LJ Ernst and GQ Zhang and HJL Bressers and JHJ Jansen",
year = "2005",
language = "Undefined/Unknown",
isbn = "0-7803-9062-8",
publisher = "IEEE Society",
pages = "120--125",
editor = "LJ Ernst and GQ Zhang and P Rodgers and S Marco and {de Saint Leger}, O",
booktitle = "Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems",
note = "6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany ; Conference date: 18-04-2005 Through 20-04-2005",
}