Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

F Rost; F Schindler-Saefkow; AR Rezaie Adli; KMB Jansen; B Wunderle; J Keller; S Rzepka; B Michel

doi:10.1109/EuroSimE.2014.6813807

Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

F Rost, F Schindler-Saefkow, AR Rezaie Adli, KMB Jansen, B Wunderle, J Keller, S Rzepka, B Michel

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

12 Citations (Scopus)

Original language	English
Title of host publication	Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems
Editors	B Vandevelde
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	1-5
Number of pages	5
ISBN (Print)	978-1-4799-4791-1
DOIs	https://doi.org/10.1109/EuroSimE.2014.6813807
Publication status	Published - 2014
Event	EuroSimE 2014: IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Ghent, Belgium Duration: 7 Apr 2014 → 9 Apr 2014

Conference

Conference	EuroSimE 2014
Country/Territory	Belgium
City	Ghent
Period	7/04/14 → 9/04/14

Access to Document

10.1109/EuroSimE.2014.6813807

Cite this

Rost, F., Schindler-Saefkow, F., Rezaie Adli, AR., Jansen, KMB., Wunderle, B., Keller, J., Rzepka, S., & Michel, B. (2014). Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip. In B. Vandevelde (Ed.), Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (pp. 1-5). IEEE Society. https://doi.org/10.1109/EuroSimE.2014.6813807

Rost, F ; Schindler-Saefkow, F ; Rezaie Adli, AR et al. / Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip. Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. editor / B Vandevelde. Piscataway : IEEE Society, 2014. pp. 1-5

@inproceedings{d14af45bd2ba414ab5416cb011d58676,

title = "Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip",

author = "F Rost and F Schindler-Saefkow and {Rezaie Adli}, AR and KMB Jansen and B Wunderle and J Keller and S Rzepka and B Michel",

year = "2014",

doi = "10.1109/EuroSimE.2014.6813807",

language = "English",

isbn = "978-1-4799-4791-1",

pages = "1--5",

editor = "B Vandevelde",

booktitle = "Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems",

publisher = "IEEE Society",

note = "EuroSimE 2014 : IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 07-04-2014 Through 09-04-2014",

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Rost, F, Schindler-Saefkow, F, Rezaie Adli, AR, Jansen, KMB, Wunderle, B, Keller, J, Rzepka, S & Michel, B 2014, Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip. in B Vandevelde (ed.), Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. IEEE Society, Piscataway, pp. 1-5, EuroSimE 2014, Ghent, Belgium, 7/04/14. https://doi.org/10.1109/EuroSimE.2014.6813807

Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip. / Rost, F; Schindler-Saefkow, F; Rezaie Adli, AR et al.
Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. ed. / B Vandevelde. Piscataway: IEEE Society, 2014. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

AU - Rost, F

AU - Schindler-Saefkow, F

AU - Rezaie Adli, AR

AU - Jansen, KMB

AU - Wunderle, B

AU - Keller, J

AU - Rzepka, S

AU - Michel, B

PY - 2014

Y1 - 2014

U2 - 10.1109/EuroSimE.2014.6813807

DO - 10.1109/EuroSimE.2014.6813807

M3 - Conference contribution

SN - 978-1-4799-4791-1

SP - 1

EP - 5

BT - Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems

A2 - Vandevelde, B

PB - IEEE Society

CY - Piscataway

T2 - EuroSimE 2014

Y2 - 7 April 2014 through 9 April 2014

ER -

Rost F, Schindler-Saefkow F, Rezaie Adli AR, Jansen KMB, Wunderle B, Keller J et al. Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip. In Vandevelde B, editor, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Piscataway: IEEE Society. 2014. p. 1-5 doi: 10.1109/EuroSimE.2014.6813807