Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques

V Gonda; KMB Jansen; LJ Ernst; J den Toonder; GQ Zhang

Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques

V Gonda, KMB Jansen, LJ Ernst, J den Toonder, GQ Zhang

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	Undefined/Unknown
Title of host publication	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Editors	LJ Ernst, GQ Zhang, P Rodgers, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	373-376
Number of pages	4
ISBN (Print)	0-7803-8420-2
Publication status	Published - 2004
Event	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Brussels, Belgium Duration: 10 May 2004 → 12 May 2004

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Country/Territory	Belgium
City	Brussels
Period	10/05/04 → 12/05/04

Bibliographical note

IEEE Cat No. 04EX831

Keywords

Conf.proc. > 3 pag

Cite this

Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J., & Zhang, GQ. (2004). Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques. In LJ. Ernst, GQ. Zhang, P. Rodgers, & O. de Saint Leger (Eds.), EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems (pp. 373-376). IEEE Society.

Gonda, V ; Jansen, KMB ; Ernst, LJ et al. / Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques. EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. editor / LJ Ernst ; GQ Zhang ; P Rodgers ; O de Saint Leger. Piscataway : IEEE Society, 2004. pp. 373-376

@inproceedings{1f1d7c0cce0e4e68af2e7c3285aa5737,

title = "Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques",

keywords = "Conf.proc. > 3 pag",

author = "V Gonda and KMB Jansen and LJ Ernst and {den Toonder}, J and GQ Zhang",

note = "IEEE Cat No. 04EX831; EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems ; Conference date: 10-05-2004 Through 12-05-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "0-7803-8420-2",

publisher = "IEEE Society",

pages = "373--376",

editor = "LJ Ernst and GQ Zhang and P Rodgers and {de Saint Leger}, O",

booktitle = "EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems",

}

Gonda, V, Jansen, KMB, Ernst, LJ, den Toonder, J & Zhang, GQ 2004, Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques. in LJ Ernst, GQ Zhang, P Rodgers & O de Saint Leger (eds), EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. IEEE Society, Piscataway, pp. 373-376, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, Brussels, Belgium, 10/05/04.

Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques. / Gonda, V; Jansen, KMB; Ernst, LJ et al.
EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. ed. / LJ Ernst; GQ Zhang; P Rodgers; O de Saint Leger. Piscataway: IEEE Society, 2004. p. 373-376.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques

AU - Gonda, V

AU - Jansen, KMB

AU - Ernst, LJ

AU - den Toonder, J

AU - Zhang, GQ

N1 - IEEE Cat No. 04EX831

PY - 2004

Y1 - 2004

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8420-2

SP - 373

EP - 376

BT - EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Rodgers, P

A2 - de Saint Leger, O

PB - IEEE Society

CY - Piscataway

T2 - EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

Y2 - 10 May 2004 through 12 May 2004

ER -

Gonda V, Jansen KMB, Ernst LJ, den Toonder J, Zhang GQ. Mechanical characterization of SiLK by Nanoindentation and substrate curvature techniques. In Ernst LJ, Zhang GQ, Rodgers P, de Saint Leger O, editors, EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. Piscataway: IEEE Society. 2004. p. 373-376