Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

Henk van Zeijl; Y. Carisey; A. Damian; Rene Poelma; Zinn, A; Guo Qi Zhang

doi:10.1109/ECTC.2016.314

Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

Henk van Zeijl, Y. Carisey, A. Damian, Rene Poelma, Zinn, A, Guo Qi Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

7 Citations (Scopus)

Abstract

We explored the properties and performance of copper-based metallic nanoparticle paste (MNPs) for interconnects applications in 3D heterogeneous integration. A patterning method was developed to process micron sized sintered MNPs structures. This enables the fabrication of IC interconnect test structures to characterise specific resistivity sintered MNPs and the contact resistances of sintered MNP to bulk copper (bCu) which was respectively 78.4 mOhm.micrometer and 0.23 Ohm.micrometer2. In situ XRD analysis showed no oxidation of MNPs at processing temperatures below 100 °C. When Copper based MNPs are sintered under forming gas conditions, no oxidation of copper is measured. With in situ TEM at a temperature range of 220 - 260 oC local melting of copper nanoparticles was observed. This is in agreement with the electrical measurements, the resistivity and contact resistance are considerably reduced when MNPs is sintered in this temperature range. Copper-based MNPs is successfully applied as die attach and wafer to wafer (W2W) bonding. However, for W2W bonding, the specific contact resistance was 800 Ohm.micrometer2.

Original language	English
Title of host publication	2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
Editors	Lisa O'Conner
Place of Publication	Piscataway
Publisher	IEEE
Pages	217-224
Number of pages	8
ISBN (Print)	978-1-5090-1204-6
DOIs	https://doi.org/10.1109/ECTC.2016.314
Publication status	Published - 2016
Event	Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th - NV, Las Vegas, United States Duration: 31 May 2016 → 3 Jun 2016 Conference number: 66 http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=20489

Conference

Conference	Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th
Abbreviated title	ECTC
Country/Territory	United States
City	Las Vegas
Period	31/05/16 → 3/06/16
Internet address	http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=20489

Keywords

copper interconnect
metallic nanoparticle paste
low-temperature sintering
3D integration

Access to Document

10.1109/ECTC.2016.314

Cite this

@inproceedings{3d05c284f60c4f039f90acaa5fb8548c,

title = "Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration",

abstract = "We explored the properties and performance of copper-based metallic nanoparticle paste (MNPs) for interconnects applications in 3D heterogeneous integration. A patterning method was developed to process micron sized sintered MNPs structures. This enables the fabrication of IC interconnect test structures to characterise specific resistivity sintered MNPs and the contact resistances of sintered MNP to bulk copper (bCu) which was respectively 78.4 mOhm.micrometer and 0.23 Ohm.micrometer2. In situ XRD analysis showed no oxidation of MNPs at processing temperatures below 100 °C. When Copper based MNPs are sintered under forming gas conditions, no oxidation of copper is measured. With in situ TEM at a temperature range of 220 - 260 oC local melting of copper nanoparticles was observed. This is in agreement with the electrical measurements, the resistivity and contact resistance are considerably reduced when MNPs is sintered in this temperature range. Copper-based MNPs is successfully applied as die attach and wafer to wafer (W2W) bonding. However, for W2W bonding, the specific contact resistance was 800 Ohm.micrometer2.",

keywords = "copper interconnect, metallic nanoparticle paste, low-temperature sintering, 3D integration",

author = "{van Zeijl}, Henk and Y. Carisey and A. Damian and Rene Poelma and Zinn, A and Zhang, {Guo Qi}",

year = "2016",

doi = "10.1109/ECTC.2016.314",

language = "English",

isbn = "978-1-5090-1204-6",

pages = "217--224",

editor = "Lisa O'Conner",

booktitle = "2016 IEEE 66th Electronic Components and Technology Conference (ECTC)",

publisher = "IEEE",

address = "United States",

note = "Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, ECTC ; Conference date: 31-05-2016 Through 03-06-2016",

url = "http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=20489",

}

van Zeijl, H, Carisey, Y, Damian, A, Poelma, R, A, Z & Zhang, GQ 2016, Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration. in L O'Conner (ed.), 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). IEEE, Piscataway, pp. 217-224, Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, Las Vegas, United States, 31/05/16. https://doi.org/10.1109/ECTC.2016.314

Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration. / van Zeijl, Henk; Carisey, Y.; Damian, A. et al.
2016 IEEE 66th Electronic Components and Technology Conference (ECTC). ed. / Lisa O'Conner. Piscataway: IEEE, 2016. p. 217-224.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

AU - van Zeijl, Henk

AU - Carisey, Y.

AU - Damian, A.

AU - Poelma, Rene

AU - A, Zinn,

AU - Zhang, Guo Qi

N1 - Conference code: 66

PY - 2016

Y1 - 2016

N2 - We explored the properties and performance of copper-based metallic nanoparticle paste (MNPs) for interconnects applications in 3D heterogeneous integration. A patterning method was developed to process micron sized sintered MNPs structures. This enables the fabrication of IC interconnect test structures to characterise specific resistivity sintered MNPs and the contact resistances of sintered MNP to bulk copper (bCu) which was respectively 78.4 mOhm.micrometer and 0.23 Ohm.micrometer2. In situ XRD analysis showed no oxidation of MNPs at processing temperatures below 100 °C. When Copper based MNPs are sintered under forming gas conditions, no oxidation of copper is measured. With in situ TEM at a temperature range of 220 - 260 oC local melting of copper nanoparticles was observed. This is in agreement with the electrical measurements, the resistivity and contact resistance are considerably reduced when MNPs is sintered in this temperature range. Copper-based MNPs is successfully applied as die attach and wafer to wafer (W2W) bonding. However, for W2W bonding, the specific contact resistance was 800 Ohm.micrometer2.

AB - We explored the properties and performance of copper-based metallic nanoparticle paste (MNPs) for interconnects applications in 3D heterogeneous integration. A patterning method was developed to process micron sized sintered MNPs structures. This enables the fabrication of IC interconnect test structures to characterise specific resistivity sintered MNPs and the contact resistances of sintered MNP to bulk copper (bCu) which was respectively 78.4 mOhm.micrometer and 0.23 Ohm.micrometer2. In situ XRD analysis showed no oxidation of MNPs at processing temperatures below 100 °C. When Copper based MNPs are sintered under forming gas conditions, no oxidation of copper is measured. With in situ TEM at a temperature range of 220 - 260 oC local melting of copper nanoparticles was observed. This is in agreement with the electrical measurements, the resistivity and contact resistance are considerably reduced when MNPs is sintered in this temperature range. Copper-based MNPs is successfully applied as die attach and wafer to wafer (W2W) bonding. However, for W2W bonding, the specific contact resistance was 800 Ohm.micrometer2.

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KW - metallic nanoparticle paste

KW - low-temperature sintering

KW - 3D integration

U2 - 10.1109/ECTC.2016.314

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M3 - Conference contribution

SN - 978-1-5090-1204-6

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BT - 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

A2 - O'Conner, Lisa

PB - IEEE

CY - Piscataway

T2 - Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th

Y2 - 31 May 2016 through 3 June 2016

ER -

Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

Abstract

Conference

Keywords

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