@inproceedings{9ba57a88b0f040529b2701e57f35ef37,
title = "Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer",
keywords = "Conf.proc. > 3 pag",
author = "D Yang and KMB Jansen and L Wang and LJ Ernst and GQ Zhang and HJL Bressers",
year = "2003",
language = "Undefined/Unknown",
isbn = "0-7803-7054-6",
publisher = "IEEE Society",
pages = "57--62",
editor = "LJ Ernst and GQ Zhang and R Dudek and {de Saint Leger}, O",
booktitle = "Thermal & mechanical simulation and experiments in microelectronics and microsystems",
note = "EuroSimE 2003 ; Conference date: 30-03-2003 Through 02-04-2003",
}