TY - JOUR
T1 - Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
AU - Liu, Yang
AU - Li, Shengli
AU - Zhang, Hao
AU - Cai, Hongming
AU - Sun, Fenglian
AU - Zhang, Guoqi
PY - 2018
Y1 - 2018
N2 - This study investigated the interfacial reaction, the microstructure, and the hardness of the SAC305-xNi solder on both Cu and graphene-coated Cu (G–Cu) substrates. The experimental results indicate that the increase of Ni content in the solder leads to the roughness of the (Cu, Ni)6Sn5 IMC layer on Cu. In contrast, the growth of the (Cu, Ni)6Sn5 interfacial IMC, which results from increasing Ni addition, is significantly suppressed on G–Cu substrates. As the concentration of Ni ranges from 0 to 0.2 wt%, the microstructure of the solder bulks on Cu substrates shows slight changes. The hardness of the solder bulks in SAC305-Ni/Cu is similar to that in the SAC305/Cu solder joint. The amount of β-Sn rises and the eutectic area shrinks due to increasing Ni addition in the solder bulks on G–Cu substrates. Therefore, the solder bulks in the SAC305-Ni/G–Cu show lower hardness than that in the SAC305/G–Cu solder joint.
AB - This study investigated the interfacial reaction, the microstructure, and the hardness of the SAC305-xNi solder on both Cu and graphene-coated Cu (G–Cu) substrates. The experimental results indicate that the increase of Ni content in the solder leads to the roughness of the (Cu, Ni)6Sn5 IMC layer on Cu. In contrast, the growth of the (Cu, Ni)6Sn5 interfacial IMC, which results from increasing Ni addition, is significantly suppressed on G–Cu substrates. As the concentration of Ni ranges from 0 to 0.2 wt%, the microstructure of the solder bulks on Cu substrates shows slight changes. The hardness of the solder bulks in SAC305-Ni/Cu is similar to that in the SAC305/Cu solder joint. The amount of β-Sn rises and the eutectic area shrinks due to increasing Ni addition in the solder bulks on G–Cu substrates. Therefore, the solder bulks in the SAC305-Ni/G–Cu show lower hardness than that in the SAC305/G–Cu solder joint.
UR - http://www.scopus.com/inward/record.url?scp=85048252318&partnerID=8YFLogxK
U2 - 10.1007/s10854-018-9440-2
DO - 10.1007/s10854-018-9440-2
M3 - Article
AN - SCOPUS:85048252318
SN - 0957-4522
VL - 29
SP - 13167
EP - 13175
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 15
ER -