Original languageUndefined/Unknown
Title of host publicationProceedings 2008 International conference on electronic packaging technology & high density packaging
EditorsK Bi, F Xiao
PublisherIEEE Society
Pages1-8
Number of pages8
ISBN (Print)978-1-4244-2740-6
Publication statusPublished - 2008

Publication series

Name
PublisherIEEE

    Research areas

  • Conf.proc. > 3 pag

ID: 1873471