Mixed mode interface characerization considering thermal redisidual stress

A Xiao; G Schlottig; B Wunderle; KMB Jansen; LJ Ernst

Mixed mode interface characerization considering thermal redisidual stress

A Xiao, G Schlottig, B Wunderle, KMB Jansen, LJ Ernst

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings 2008 International conference on electronic packaging technology & high density packaging
Editors	K Bi, F Xiao
Publisher	IEEE Society
Pages	1-8
Number of pages	8
ISBN (Print)	978-1-4244-2740-6
Publication status	Published - 2008

Publication series

Name
Publisher	IEEE

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{4541785704bb4a01a53ef778b541163c,

title = "Mixed mode interface characerization considering thermal redisidual stress",

keywords = "Conf.proc. > 3 pag",

author = "A Xiao and G Schlottig and B Wunderle and KMB Jansen and LJ Ernst",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-1-4244-2740-6",

publisher = "IEEE Society",

pages = "1--8",

editor = "K Bi and F Xiao",

booktitle = "Proceedings 2008 International conference on electronic packaging technology & high density packaging",

}

Mixed mode interface characerization considering thermal redisidual stress. / Xiao, A; Schlottig, G; Wunderle, B et al.
Proceedings 2008 International conference on electronic packaging technology & high density packaging. ed. / K Bi; F Xiao. IEEE Society, 2008. p. 1-8.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Mixed mode interface characerization considering thermal redisidual stress

AU - Xiao, A

AU - Schlottig, G

AU - Wunderle, B

AU - Jansen, KMB

AU - Ernst, LJ

PY - 2008

Y1 - 2008

KW - Conf.proc. > 3 pag

UR - http://www.ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=04607131

M3 - Conference contribution

SN - 978-1-4244-2740-6

SP - 1

EP - 8

BT - Proceedings 2008 International conference on electronic packaging technology & high density packaging

A2 - Bi, K

A2 - Xiao, F

PB - IEEE Society

ER -

Mixed mode interface characerization considering thermal redisidual stress

Publication series

Keywords

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Cite this