Standard

Mixed mode interface characerization considering thermal redisidual stress. / Xiao, A; Schlottig, G; Wunderle, B; Jansen, KMB; Ernst, LJ.

Proceedings 2008 International conference on electronic packaging technology & high density packaging. ed. / K Bi; F Xiao. IEEE Society, 2008. p. 1-8.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Harvard

Xiao, A, Schlottig, G, Wunderle, B, Jansen, KMB & Ernst, LJ 2008, Mixed mode interface characerization considering thermal redisidual stress. in K Bi & F Xiao (eds), Proceedings 2008 International conference on electronic packaging technology & high density packaging. IEEE Society, pp. 1-8.

APA

Xiao, A., Schlottig, G., Wunderle, B., Jansen, KMB., & Ernst, LJ. (2008). Mixed mode interface characerization considering thermal redisidual stress. In K. Bi, & F. Xiao (Eds.), Proceedings 2008 International conference on electronic packaging technology & high density packaging (pp. 1-8). IEEE Society.

Vancouver

Xiao A, Schlottig G, Wunderle B, Jansen KMB, Ernst LJ. Mixed mode interface characerization considering thermal redisidual stress. In Bi K, Xiao F, editors, Proceedings 2008 International conference on electronic packaging technology & high density packaging. IEEE Society. 2008. p. 1-8

Author

Xiao, A ; Schlottig, G ; Wunderle, B ; Jansen, KMB ; Ernst, LJ. / Mixed mode interface characerization considering thermal redisidual stress. Proceedings 2008 International conference on electronic packaging technology & high density packaging. editor / K Bi ; F Xiao. IEEE Society, 2008. pp. 1-8

BibTeX

@inproceedings{4541785704bb4a01a53ef778b541163c,
title = "Mixed mode interface characerization considering thermal redisidual stress",
keywords = "Conf.proc. > 3 pag",
author = "A Xiao and G Schlottig and B Wunderle and KMB Jansen and LJ Ernst",
year = "2008",
language = "Undefined/Unknown",
isbn = "978-1-4244-2740-6",
publisher = "IEEE Society",
pages = "1--8",
editor = "K Bi and F Xiao",
booktitle = "Proceedings 2008 International conference on electronic packaging technology & high density packaging",

}

RIS

TY - GEN

T1 - Mixed mode interface characerization considering thermal redisidual stress

AU - Xiao, A

AU - Schlottig, G

AU - Wunderle, B

AU - Jansen, KMB

AU - Ernst, LJ

PY - 2008

Y1 - 2008

KW - Conf.proc. > 3 pag

UR - http://www.ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=04607131

M3 - Conference contribution

SN - 978-1-4244-2740-6

SP - 1

EP - 8

BT - Proceedings 2008 International conference on electronic packaging technology & high density packaging

A2 - Bi, K

A2 - Xiao, F

PB - IEEE Society

ER -

ID: 1873471