• KMB Jansen
  • C Qian
  • LJ Ernst
  • C Bohm
  • A Kessler
  • H Preu
  • M Stecher
During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die.
Original languageUndefined/Unknown
Pages (from-to)872-876
Number of pages5
JournalMicroelectronics Reliability
Volume49
Issue number2009
Publication statusPublished - 2009

    Research areas

  • academic journal papers, CWTS JFIS < 0.75

ID: 3772992