Abstract
During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die.
Original language | Undefined/Unknown |
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Pages (from-to) | 872-876 |
Number of pages | 5 |
Journal | Microelectronics Reliability |
Volume | 49 |
Issue number | 2009 |
Publication status | Published - 2009 |
Keywords
- academic journal papers
- CWTS JFIS < 0.75