• M van Soestbergen
  • A Mavinkurve
  • RTH Rongen
  • LJ Ernst
  • GQ Zhang
Plastic encapsulations will absorb moisture in humid environments due to their hydrophilic nature, this in combination with the inherent ionic contamination of the plastic will result in an electrolyte. This electrolyte might pose several reliability issues for the package and the encapsulated microelectronic circuit, such as electrochemical migration and bond pad corrosion. The corresponding failure mechanisms are associated with ionic currents through the package and electrochemical processes at e.g. the leads or bond wires. In this paper we present a generic mathematical framework for modeling ionic currents and electrochemical processes. We will apply this framework to electrochemical migration of metal between the leads of a plastic encapsulation, and show results for the transient formation of migration fluxes through the plastic encapsulation.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, 10-13 August 2009, Beijing, China
Editors Bi, K, Cai, J
Place of PublicationBeijing, China
PublisherIEEE Society
Pages1079-1082
Number of pages4
ISBN (Print)978-1-4244-4659-9
Publication statusPublished - 2009
Event2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, Beijing, China - Beijing, China
Duration: 10 Aug 200913 Aug 2009

Publication series

Name
PublisherIEEE

Conference

Conference2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, Beijing, China
Period10/08/0913/08/09

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 1656904