Modeling ion transport through molding compounds and its relation to product reliability

M van Soestbergen, RTH Rongen, LJ Ernst, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

9 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings 2008 International conference on electronic packaging technology & high density packaging
EditorsK Bi, F Xiao
PublisherIEEE Society
Pages1-8
Number of pages8
ISBN (Print)978-1-4244-2740-6
Publication statusPublished - 2008

Publication series

Name
PublisherIEEE

Keywords

  • Conf.proc. > 3 pag

Cite this