@inproceedings{d5c0988eae4e498d8feafa70ef70f65e,
title = "Modeling ion transport through molding compounds and its relation to product reliability",
keywords = "Conf.proc. > 3 pag",
author = "{van Soestbergen}, M and RTH Rongen and LJ Ernst and GQ Zhang",
year = "2008",
language = "Undefined/Unknown",
isbn = "978-1-4244-2740-6",
publisher = "IEEE Society",
pages = "1--8",
editor = "K Bi and F Xiao",
booktitle = "Proceedings 2008 International conference on electronic packaging technology & high density packaging",
}