@inproceedings{8aeb06ccf6004056b3fef628c1f6995f,
title = "Modeling of cure-induced warpage of plastic IC packages",
keywords = "Conf.proc. > 3 pag",
author = "D Yang and KMB Jansen and LJ Ernst and GQ Zhang and {van Driel}, WD and HJL Bressers",
note = "IEEE Cat No. 04EX831; EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems ; Conference date: 10-05-2004 Through 12-05-2004",
year = "2004",
language = "Undefined/Unknown",
isbn = "0-7803-8420-2",
publisher = "IEEE Society",
pages = "33--40",
editor = "LJ Ernst and GQ Zhang and P Rodgers and {de Saint Leger}, O",
booktitle = "EuroSimE 2004: 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems",
}