Thermal analysis plays a crucial role in designing and reliability of contemporary semiconductor devices. In this paper, the analogy between the electrical and thermal systems is extended for analysis of nonlinear two dimensional hyperbolic heat conduction (HHC) in Silicon-On-Insulator (SOI) transistor. The equivalent Resistance-Inductance-Capacitance(RLC) transmission line network is solved fast and easily by an electric solver tool such as HSPICE. The influence of a temperature dependent thermal conductivity and relaxation time in temperature distribution is discussed. The results demonstrate the wave character phenomena of the heat propagation that is occurring in nano-scaled high frequency electronic devices.

Original languageEnglish
Title of host publication2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages1-5
Number of pages5
ISBN (Electronic)978-1-5386-2359-6
DOIs
Publication statusPublished - 2018
EventEuroSimE 2018: 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Toulouse, France
Duration: 15 Apr 201818 Apr 2018

Conference

ConferenceEuroSimE 2018
Abbreviated titleEuroSimE 2018
CountryFrance
CityToulouse
Period15/04/1818/04/18

    Research areas

  • Heating systems, Mathematical model, Conductivity, Nanoscale devices, Heat transfer, Transistors

ID: 45584498