Moisture Diffusion Model Verification of Packaging Materials

X Ma; KMB Jansen; LJ Ernst; WD van Driel; O van der Sluis; GQ Zhang; C Regard; C Gautier; H Frémont

Moisture Diffusion Model Verification of Packaging Materials

X Ma, KMB Jansen, LJ Ernst, WD van Driel, O van der Sluis, GQ Zhang, C Regard, C Gautier, H Frémont

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Abstract

The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China
Editors	Keyun Bi, Fei Xiao
Publisher	IEEE Society
Pages	636-640
Number of pages	5
ISBN (Print)	978-1-4244-2740-6
Publication status	Published - 2008

Publication series

Name
Publisher	IEEE

Name
Volume	1

Bibliographical note

Niet eerder opgevoerd

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C., & Frémont, H. (2008). Moisture Diffusion Model Verification of Packaging Materials. In Keyun Bi, & Fei Xiao (Eds.), Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China (pp. 636-640). IEEE Society.

@inproceedings{a6e5ab30f1b14645b59a52a00dd60277,

title = "Moisture Diffusion Model Verification of Packaging Materials",

abstract = "The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "X Ma and KMB Jansen and LJ Ernst and {van Driel}, WD and {van der Sluis}, O and GQ Zhang and C Regard and C Gautier and H Fr{\'e}mont",

note = "Niet eerder opgevoerd",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-1-4244-2740-6",

publisher = "IEEE Society",

pages = "636--640",

editor = "{Keyun Bi} and {Fei Xiao}",

booktitle = "Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China",

}

Ma, X, Jansen, KMB, Ernst, LJ, van Driel, WD, van der Sluis, O, Zhang, GQ, Regard, C, Gautier, C & Frémont, H 2008, Moisture Diffusion Model Verification of Packaging Materials. in Keyun Bi & Fei Xiao (eds), Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China. IEEE Society, pp. 636-640.

Moisture Diffusion Model Verification of Packaging Materials. / Ma, X; Jansen, KMB; Ernst, LJ et al.
Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China. ed. / Keyun Bi; Fei Xiao. IEEE Society, 2008. p. 636-640.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Moisture Diffusion Model Verification of Packaging Materials

AU - Ma, X

AU - Jansen, KMB

AU - Ernst, LJ

AU - van Driel, WD

AU - van der Sluis, O

AU - Zhang, GQ

AU - Regard, C

AU - Gautier, C

AU - Frémont, H

N1 - Niet eerder opgevoerd

PY - 2008

Y1 - 2008

N2 - The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.

AB - The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-2740-6

SP - 636

EP - 640

BT - Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China

A2 - Keyun Bi, null

A2 - Fei Xiao, null

PB - IEEE Society

ER -