The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), July 28-31, 2008, Shanghai, China
Editors Keyun Bi, Fei Xiao
PublisherIEEE Society
Pages636-640
Number of pages5
ISBN (Print)978-1-4244-2740-6
Publication statusPublished - 2008

Publication series

Name
PublisherIEEE
Name
Volume1

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 3442644