Moisture induced failures in the plastic encapsulated packages are one of the most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTA, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85°C/85%RH, 60°C/60%RH and 85°C/dry, 60°C/dry using 2D SiP (System in Package) finite element model.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands
Editors Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de
PublisherIEEE Society
Pages379-383
Number of pages5
ISBN (Print)978-1-4244-4159-4
Publication statusPublished - 2009

Publication series

Name
PublisherIEEE

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 2783421