Moisture Effects on a System in Package Carrier

X Ma; KMB Jansen; LJ Ernst; WD van Driel; O van der Sluis; GQ Zhang

Moisture Effects on a System in Package Carrier

X Ma, KMB Jansen, LJ Ernst, WD van Driel, O van der Sluis, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Abstract

Moisture induced failures in the plastic encapsulated packages are one of the most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTA, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85°C/85%RH, 60°C/60%RH and 85°C/dry, 60°C/dry using 2D SiP (System in Package) finite element model.

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands
Editors	Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de
Publisher	IEEE Society
Pages	379-383
Number of pages	5
ISBN (Print)	978-1-4244-4159-4
Publication status	Published - 2009

Publication series

Name
Publisher	IEEE

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., & Zhang, GQ. (2009). Moisture Effects on a System in Package Carrier. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., & Saint Leger, O. de (Eds.), Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands (pp. 379-383). IEEE Society.

Ma, X ; Jansen, KMB ; Ernst, LJ et al. / Moisture Effects on a System in Package Carrier. Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. editor / Ernst, L.J. ; Zhang, G.Q. ; Driel, W.D. van ; Rodgers, P. ; Bailey, C. ; Saint Leger, O. de. IEEE Society, 2009. pp. 379-383

@inproceedings{3db7775ffa114d59a91053b8f5563d71,

title = "Moisture Effects on a System in Package Carrier",

abstract = "Moisture induced failures in the plastic encapsulated packages are one of the most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTA, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85°C/85%RH, 60°C/60%RH and 85°C/dry, 60°C/dry using 2D SiP (System in Package) finite element model.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "X Ma and KMB Jansen and LJ Ernst and {van Driel}, WD and {van der Sluis}, O and GQ Zhang",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-4159-4",

publisher = "IEEE Society",

pages = "379--383",

editor = "{Ernst, L.J.} and {Zhang, G.Q.} and {Driel, W.D. van} and {Rodgers, P.} and {Bailey, C.} and {Saint Leger, O. de}",

booktitle = "Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands",

}

Ma, X, Jansen, KMB, Ernst, LJ, van Driel, WD, van der Sluis, O & Zhang, GQ 2009, Moisture Effects on a System in Package Carrier. in Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds), Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. IEEE Society, pp. 379-383.

Moisture Effects on a System in Package Carrier. / Ma, X; Jansen, KMB; Ernst, LJ et al.
Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. ed. / Ernst, L.J.; Zhang, G.Q.; Driel, W.D. van; Rodgers, P.; Bailey, C.; Saint Leger, O. de. IEEE Society, 2009. p. 379-383.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Moisture Effects on a System in Package Carrier

AU - Ma, X

AU - Jansen, KMB

AU - Ernst, LJ

AU - van Driel, WD

AU - van der Sluis, O

AU - Zhang, GQ

PY - 2009

Y1 - 2009

N2 - Moisture induced failures in the plastic encapsulated packages are one of the most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTA, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85°C/85%RH, 60°C/60%RH and 85°C/dry, 60°C/dry using 2D SiP (System in Package) finite element model.

AB - Moisture induced failures in the plastic encapsulated packages are one of the most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTA, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85°C/85%RH, 60°C/60%RH and 85°C/dry, 60°C/dry using 2D SiP (System in Package) finite element model.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-4159-4

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EP - 383

BT - Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands

A2 - Ernst, L.J., null

A2 - Zhang, G.Q., null

A2 - Driel, W.D. van, null

A2 - Rodgers, P., null

A2 - Bailey, C., null

A2 - Saint Leger, O. de, null

PB - IEEE Society

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Ma X, Jansen KMB, Ernst LJ, van Driel WD, van der Sluis O, Zhang GQ. Moisture Effects on a System in Package Carrier. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de, editors, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. IEEE Society. 2009. p. 379-383