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Multi-LED package design, fabrication and thermal analysis. / Poelma, RH; Tarashioon, S; van Zeijl, HW; Goldbach, S; Zijl, JLJ; Zhang, GQ.

In: Journal of Semiconductors, Vol. 34, No. 5, 2013, p. 1-5.

Research output: Contribution to journalArticleScientificpeer-review

Harvard

Poelma, RH, Tarashioon, S, van Zeijl, HW, Goldbach, S, Zijl, JLJ & Zhang, GQ 2013, 'Multi-LED package design, fabrication and thermal analysis' Journal of Semiconductors, vol. 34, no. 5, pp. 1-5. https://doi.org/10.1088/1674-4926/34/5/054002

APA

Vancouver

Author

Poelma, RH ; Tarashioon, S ; van Zeijl, HW ; Goldbach, S ; Zijl, JLJ ; Zhang, GQ. / Multi-LED package design, fabrication and thermal analysis. In: Journal of Semiconductors. 2013 ; Vol. 34, No. 5. pp. 1-5.

BibTeX

@article{ff4e5b6c6d844b988773a1c462c78935,
title = "Multi-LED package design, fabrication and thermal analysis",
author = "RH Poelma and S Tarashioon and {van Zeijl}, HW and S Goldbach and JLJ Zijl and GQ Zhang",
note = "Harvest",
year = "2013",
doi = "10.1088/1674-4926/34/5/054002",
language = "English",
volume = "34",
pages = "1--5",
journal = "Journal of Semiconductors",
issn = "1674-4926",
publisher = "IOS Press",
number = "5",

}

RIS

TY - JOUR

T1 - Multi-LED package design, fabrication and thermal analysis

AU - Poelma, RH

AU - Tarashioon, S

AU - van Zeijl, HW

AU - Goldbach, S

AU - Zijl, JLJ

AU - Zhang, GQ

N1 - Harvest

PY - 2013

Y1 - 2013

U2 - 10.1088/1674-4926/34/5/054002

DO - 10.1088/1674-4926/34/5/054002

M3 - Article

VL - 34

SP - 1

EP - 5

JO - Journal of Semiconductors

T2 - Journal of Semiconductors

JF - Journal of Semiconductors

SN - 1674-4926

IS - 5

ER -

ID: 1451955