• RH Poelma
  • H Sadeghian Marnani
  • SPM Noijen
  • JJM Zaal
  • GQ Zhang
Thin metal films are widely used in modern electro mechanical systems. The need for more integrated functionality and minimization of material and energy consumption leads to miniaturization of these systems. As a consequence, materials are processed on the micro- and nanometer scale. On this scale, material properties become a function of size. To predict performance and reliability, knowledge on the size dependence of material properties is imperative. In this work the unknown size dependence of the copper Young's modulus is determined by electrostatic pull-in experiments performed on bilayer copper-silicon nanocantilevers. The size effect is also predicted with a multi-scale (MS) method. In this method atomistic simulations predict the bulk elastic and surface properties of mono-crystalline silicon (Si) and poly-crystalline copper (Cu). These results are combined to represent the bilayer nanocantilevers of the experiment in a continuum model. The model is verified by comparison with a well documented size effect of the effective Si Young's modulus. It is shown that the experimental method can be used for determining the Young's modulus of thin Cu films in the 10 to 50 nm range. Both the experimental results and the MS simulation results show that there is a strong size effect present in Si and Cu.
Original languageEnglish
Title of host publicationProceedings of the 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) 2010
Editors Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de
Place of PublicationBordeaux, France
Number of pages9
ISBN (Print)978-1-4244-7026-6
Publication statusPublished - 2010
EventEuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems - Bordeaux, Frankrijk, Bordeaux, France
Duration: 25 Apr 201028 Apr 2010
Conference number: 11

Publication series



ConferenceEuroSimE 2010 

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 3710965