Abstract
Thin metal films are widely used in modern electro mechanical systems. The need for more integrated functionality and minimization of material and energy consumption leads to miniaturization of these systems. As a consequence, materials are processed on the micro- and nanometer scale. On this scale, material properties become a function of size. To predict performance and reliability, knowledge on the size dependence of material properties is imperative. In this work the unknown size dependence of the copper Young's modulus is determined by electrostatic pull-in experiments performed on bilayer copper-silicon nanocantilevers. The size effect is also predicted with a multi-scale (MS) method. In this method atomistic simulations predict the bulk elastic and surface properties of mono-crystalline silicon (Si) and poly-crystalline copper (Cu). These results are combined to represent the bilayer nanocantilevers of the experiment in a continuum model. The model is verified by comparison with a well documented size effect of the effective Si Young's modulus. It is shown that the experimental method can be used for determining the Young's modulus of thin Cu films in the 10 to 50 nm range. Both the experimental results and the MS simulation results show that there is a strong size effect present in Si and Cu.
Original language | English |
---|---|
Title of host publication | Proceedings of the 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) 2010 |
Editors | Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de |
Place of Publication | Bordeaux, France |
Publisher | EuroSimE |
Pages | 1-9 |
Number of pages | 9 |
ISBN (Print) | 978-1-4244-7026-6 |
DOIs | |
Publication status | Published - 2010 |
Event | EuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems - Bordeaux, Frankrijk, Bordeaux, France Duration: 25 Apr 2010 → 28 Apr 2010 Conference number: 11 |
Publication series
Name | |
---|---|
Publisher | EuroSimE |
Conference
Conference | EuroSimE 2010 |
---|---|
Country/Territory | France |
City | Bordeaux |
Period | 25/04/10 → 28/04/10 |
Keywords
- conference contrib. refereed
- Conf.proc. > 3 pag