@inproceedings{77f357edfb164b64b040ccdee56135e1,
title = "Novel system-in-package design and packaging solution for solid state lighting systems",
author = "M Dong and F Santagata and J Wei and C Yuan and GQ Zhang",
note = "Harvest; ECTC 2014, Orlando, Florida ; Conference date: 27-05-2014 Through 30-05-2014",
year = "2014",
doi = "10.1109/ECTC.2014.6897442",
language = "English",
isbn = "978-147992407-3",
publisher = "IEEE Society",
pages = "1192--1197",
editor = "W Sauter and A Huffman",
booktitle = "Proceedings - 64th Electronic Components and Technology Conference",
}