Warpage is a critical issue for QFN array molding process. In this paper, a cure-dependent viscoelastic constitutive model is established to model the cure-induced warpage in array molding process. For the relaxation modulus functions of the packaging polymer , the equilibrium moduli are modeled with a model based on scaling analysis and the relaxation behavior of the transient part is described by the cure-dependent relaxation amplitude and reduced relaxation times which are based on the time-conversion superposition principle. The cure-dependent parameters are characterized by using an integrated approach of dynamical mechanical analysis (DMA) and differential scanning calorimetry (DSC) measurements. Finite element modeling is carried out for three configurations of a carrier package during the curing process has significant contribution on the toal warpage of the map.
Original languageUndefined/Unknown
Pages (from-to)310-318
Number of pages9
JournalMicroelectronics Reliability
Volume47
Publication statusPublished - 2007

    Research areas

  • academic journal papers, CWTS JFIS < 0.75

ID: 3221972