Original languageEnglish
Title of host publicationThermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EurosimE 2015), proceedings of the 16 international conference
Editors s.n.
Place of PublicationPiscataway, NJ
PublisherIEEE Society
Pages1-6
Number of pages6
ISBN (Print)978-1-4799-9949-1
DOIs
Publication statusPublished - 2015
EventEuroSimE 2015: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Budapest, Hungary
Duration: 19 Apr 201522 Apr 2015
Conference number: 16
https://www.eurosime.org/index.php/2015-budapest/ (Conference program)
https://ieeexplore-ieee-org.tudelft.idm.oclc.org/servlet/opac?punumber=7095627 (Proceedings)

Conference

ConferenceEuroSimE 2015
Abbreviated titleEuroSimE 2015
CountryHungary
CityBudapest
Period19/04/1522/04/15
Internet address

ID: 3792935