On maximizing the compound yield for 3D wafer-to-wafer stacked ICs

M Taouil, S Hamdioui, J Verbree, E Marinissen

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

31 Citations (Scopus)

Original language	English
Title of host publication	Intl. TEST conference 2010
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	1-10
Number of pages	10
ISBN (Print)	978-1-4244-7205-5
Publication status	Published - 2010
Event	ITC 2010 - Piscataway Duration: 31 Oct 2010 → 5 Nov 2010

Name
Publisher	IEEE

Conference	ITC 2010
Period	31/10/10 → 5/11/10

Keywords

@inproceedings{62096aa1846a4e7faa2ed7ec4fd38b30,

title = "On maximizing the compound yield for 3D wafer-to-wafer stacked ICs",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Taouil and S Hamdioui and J Verbree and E Marinissen",

year = "2010",

language = "English",

isbn = "978-1-4244-7205-5",

publisher = "IEEE Society",

pages = "1--10",

editor = "s.n.",

booktitle = "Intl. TEST conference 2010",

note = "ITC 2010 ; Conference date: 31-10-2010 Through 05-11-2010",

}

TY - GEN

T1 - On maximizing the compound yield for 3D wafer-to-wafer stacked ICs

AU - Taouil, M

AU - Hamdioui, S

AU - Verbree, J

AU - Marinissen, E

PY - 2010

Y1 - 2010

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-7205-5

SP - 1

EP - 10

BT - Intl. TEST conference 2010

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

T2 - ITC 2010

Y2 - 31 October 2010 through 5 November 2010

ER -