Standard

On maximizing the compound yield for 3D wafer-to-wafer stacked ICs. / Taouil, M; Hamdioui, S; Verbree, J; Marinissen, E.

Intl. TEST conference 2010. ed. / s.n. Piscataway : IEEE Society, 2010. p. 1-10.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Harvard

Taouil, M, Hamdioui, S, Verbree, J & Marinissen, E 2010, On maximizing the compound yield for 3D wafer-to-wafer stacked ICs. in s.n. (ed.), Intl. TEST conference 2010. IEEE Society, Piscataway, pp. 1-10, ITC 2010, 31/10/10.

APA

Taouil, M., Hamdioui, S., Verbree, J., & Marinissen, E. (2010). On maximizing the compound yield for 3D wafer-to-wafer stacked ICs. In s.n. (Ed.), Intl. TEST conference 2010 (pp. 1-10). Piscataway: IEEE Society.

Vancouver

Taouil M, Hamdioui S, Verbree J, Marinissen E. On maximizing the compound yield for 3D wafer-to-wafer stacked ICs. In s.n., editor, Intl. TEST conference 2010. Piscataway: IEEE Society. 2010. p. 1-10

Author

Taouil, M ; Hamdioui, S ; Verbree, J ; Marinissen, E. / On maximizing the compound yield for 3D wafer-to-wafer stacked ICs. Intl. TEST conference 2010. editor / s.n. Piscataway : IEEE Society, 2010. pp. 1-10

BibTeX

@inproceedings{62096aa1846a4e7faa2ed7ec4fd38b30,
title = "On maximizing the compound yield for 3D wafer-to-wafer stacked ICs",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "M Taouil and S Hamdioui and J Verbree and E Marinissen",
year = "2010",
language = "English",
isbn = "978-1-4244-7205-5",
publisher = "IEEE Society",
pages = "1--10",
editor = "s.n.",
booktitle = "Intl. TEST conference 2010",

}

RIS

TY - GEN

T1 - On maximizing the compound yield for 3D wafer-to-wafer stacked ICs

AU - Taouil, M

AU - Hamdioui, S

AU - Verbree, J

AU - Marinissen, E

PY - 2010

Y1 - 2010

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-7205-5

SP - 1

EP - 10

BT - Intl. TEST conference 2010

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

ER -

ID: 3987168