On the stress, strain and damage evolution in thermosetting polymers due to assembly processing of electronic packages

LJ Ernst, C van t Hof, DG Yang, ? et al

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of the fourth international symposium on electronic packaging technology, August 8-11
Editors	K Bi, et al
Place of Publication	s.l.
Publisher	IEEE Society
Pages	365-369
Number of pages	5
ISBN (Print)	0-7803-9811-4
Publication status	Published - 2001
Event	ISEPT '2001, Beijng - s.l. Duration: 8 Aug 2001 → 11 Aug 2001

Name
Publisher	IEEE

Conference	ISEPT '2001, Beijng
Period	8/08/01 → 11/08/01

Keywords

@inproceedings{e832de08f36f4e21a7e5e87d34b3ff18,

title = "On the stress, strain and damage evolution in thermosetting polymers due to assembly processing of electronic packages",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "LJ Ernst and {van t Hof}, C and DG Yang and {et al}, ?",

year = "2001",

language = "Undefined/Unknown",

isbn = "0-7803-9811-4",

publisher = "IEEE Society",

pages = "365--369",

editor = "{K Bi} and {et al}",

booktitle = "Proceedings of the fourth international symposium on electronic packaging technology, August 8-11",

note = "ISEPT '2001, Beijng ; Conference date: 08-08-2001 Through 11-08-2001",

}

On the stress, strain and damage evolution in thermosetting polymers due to assembly processing of electronic packages. / Ernst, LJ; van t Hof, C; Yang, DG et al.
Proceedings of the fourth international symposium on electronic packaging technology, August 8-11. ed. / K Bi; et al. s.l.: IEEE Society, 2001. p. 365-369.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - On the stress, strain and damage evolution in thermosetting polymers due to assembly processing of electronic packages

AU - Ernst, LJ

AU - van t Hof, C

AU - Yang, DG

AU - et al, ?

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-7803-9811-4

SP - 365

EP - 369

BT - Proceedings of the fourth international symposium on electronic packaging technology, August 8-11

A2 - K Bi, null

A2 - et al, null

PB - IEEE Society

CY - s.l.

T2 - ISEPT '2001, Beijng

Y2 - 8 August 2001 through 11 August 2001

ER -