On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

J Zhang; S van der Zwaag; HW van Zeijl; GQ Zhang

doi:10.1109/ECTC.2013.6575571

On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

J Zhang, S van der Zwaag, HW van Zeijl, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	English
Title of host publication	Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013)
Editors	W Sauter
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	192-199
Number of pages	8
ISBN (Print)	978-1-4799-0233-0
DOIs	https://doi.org/10.1109/ECTC.2013.6575571
Publication status	Published - 2013
Event	ECTC 2013, Las Vegas, Nevada - Piscataway Duration: 28 May 2013 → 31 May 2013

Publication series

Name
Publisher	IEEE

Conference

Conference	ECTC 2013, Las Vegas, Nevada
Period	28/05/13 → 31/05/13

Bibliographical note

Harvest

Keywords

Conf.proc. > 3 pag

Access to Document

10.1109/ECTC.2013.6575571

Cite this

Zhang, J., van der Zwaag, S., van Zeijl, HW., & Zhang, GQ. (2013). On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects. In W. Sauter (Ed.), Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013) (pp. 192-199). IEEE Society. https://doi.org/10.1109/ECTC.2013.6575571

@inproceedings{ac626bced183415182daf365e53feb36,

title = "On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects",

keywords = "Conf.proc. > 3 pag",

author = "J Zhang and {van der Zwaag}, S and {van Zeijl}, HW and GQ Zhang",

note = "Harvest; ECTC 2013, Las Vegas, Nevada ; Conference date: 28-05-2013 Through 31-05-2013",

year = "2013",

doi = "10.1109/ECTC.2013.6575571",

language = "English",

isbn = "978-1-4799-0233-0",

publisher = "IEEE Society",

pages = "192--199",

editor = "W Sauter",

booktitle = "Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013)",

}

Zhang, J, van der Zwaag, S , van Zeijl, HW & Zhang, GQ 2013, On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects. in W Sauter (ed.), Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). IEEE Society, Piscataway, pp. 192-199, ECTC 2013, Las Vegas, Nevada, 28/05/13. https://doi.org/10.1109/ECTC.2013.6575571

On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects. / Zhang, J; van der Zwaag, S ; van Zeijl, HW et al.
Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). ed. / W Sauter. Piscataway: IEEE Society, 2013. p. 192-199.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

AU - Zhang, J

AU - van der Zwaag, S

AU - van Zeijl, HW

AU - Zhang, GQ

N1 - Harvest

PY - 2013

Y1 - 2013

KW - Conf.proc. > 3 pag

U2 - 10.1109/ECTC.2013.6575571

DO - 10.1109/ECTC.2013.6575571

M3 - Conference contribution

SN - 978-1-4799-0233-0

SP - 192

EP - 199

BT - Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013)

A2 - Sauter, W

PB - IEEE Society

CY - Piscataway

T2 - ECTC 2013, Las Vegas, Nevada

Y2 - 28 May 2013 through 31 May 2013

ER -

Zhang J, van der Zwaag S , van Zeijl HW , Zhang GQ. On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects. In Sauter W, editor, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Piscataway: IEEE Society. 2013. p. 192-199 doi: 10.1109/ECTC.2013.6575571