Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane

W. J. Westerveld; S. M. Leinders; P. L.M.J. Van Neer; H. P. Urbach; N. De Jong; M. D. Verweij; X. Rottenberg; V. Rochus

doi:10.1109/EuroSimE.2019.8724528

Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane

W. J. Westerveld, S. M. Leinders, P. L.M.J. Van Neer, H. P. Urbach, N. De Jong, M. D. Verweij, X. Rottenberg, V. Rochus

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Abstract

Future applications of ultrasonography in (bio-)medical imaging require ultrasound sensor matrices with small sensitive elements. Promising are opto-mechanical ultrasound sensors (OMUS) based on a silicon photonic ring resonator embedded in a silicon-dioxide acoustical membrane. This work presents new OMUS modelling: acousto-mechanical non-linear FEM and photonic circuit equations. We show that initial wafer stress needs to be considered in the design: the acoustical resonance frequency changes considerably and OMUS sensitivity differs for up-or downwards buckled membranes. Simulated acoustical resonance frequency agrees well with measurements, assuming realistic SOI wafer stress. Measured sensitivity showed large device-to-device variation and simulations agree within this order of magnitude. We conclude that careful modeling of stress is necessary (b) for the design of robust and sensitive sensors.

Original language	English
Title of host publication	2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Editors	Willem van Driel
Place of Publication	Piscataway, NJ, USA
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Number of pages	7
ISBN (Electronic)	978-1-5386-8040-7
DOIs	https://doi.org/10.1109/EuroSimE.2019.8724528
Publication status	Published - 2019
Event	20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Hannover, Germany Duration: 24 Mar 2019 → 27 Mar 2019 Conference number: 20th

Publication series

Name	2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019

Conference

Conference	20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Country/Territory	Germany
City	Hannover
Period	24/03/19 → 27/03/19

Access to Document

10.1109/EuroSimE.2019.8724528

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Westerveld, W. J., Leinders, S. M., Van Neer, P. L. M. J., Urbach, H. P., De Jong, N., Verweij, M. D., Rottenberg, X., & Rochus, V. (2019). Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane. In W. van Driel (Ed.), 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019 Article 8724528 (2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/EuroSimE.2019.8724528

Westerveld, W. J. ; Leinders, S. M. ; Van Neer, P. L.M.J. et al. / Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane. 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. editor / Willem van Driel. Piscataway, NJ, USA : Institute of Electrical and Electronics Engineers (IEEE), 2019. (2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019).

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title = "Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane",

abstract = "Future applications of ultrasonography in (bio-)medical imaging require ultrasound sensor matrices with small sensitive elements. Promising are opto-mechanical ultrasound sensors (OMUS) based on a silicon photonic ring resonator embedded in a silicon-dioxide acoustical membrane. This work presents new OMUS modelling: acousto-mechanical non-linear FEM and photonic circuit equations. We show that initial wafer stress needs to be considered in the design: the acoustical resonance frequency changes considerably and OMUS sensitivity differs for up-or downwards buckled membranes. Simulated acoustical resonance frequency agrees well with measurements, assuming realistic SOI wafer stress. Measured sensitivity showed large device-to-device variation and simulations agree within this order of magnitude. We conclude that careful modeling of stress is necessary (b) for the design of robust and sensitive sensors.",

author = "Westerveld, {W. J.} and Leinders, {S. M.} and {Van Neer}, {P. L.M.J.} and Urbach, {H. P.} and {De Jong}, N. and Verweij, {M. D.} and X. Rottenberg and V. Rochus",

year = "2019",

doi = "10.1109/EuroSimE.2019.8724528",

language = "English",

series = "2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

editor = "{van Driel}, Willem",

booktitle = "2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019",

address = "United States",

note = "20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019 : 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 24-03-2019 Through 27-03-2019",

}

Westerveld, WJ, Leinders, SM, Van Neer, PLMJ , Urbach, HP , De Jong, N , Verweij, MD, Rottenberg, X & Rochus, V 2019, Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane. in W van Driel (ed.), 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019., 8724528, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019, Institute of Electrical and Electronics Engineers (IEEE), Piscataway, NJ, USA, 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019, Hannover, Germany, 24/03/19. https://doi.org/10.1109/EuroSimE.2019.8724528

Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane. / Westerveld, W. J.; Leinders, S. M.; Van Neer, P. L.M.J. et al.
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. ed. / Willem van Driel. Piscataway, NJ, USA: Institute of Electrical and Electronics Engineers (IEEE), 2019. 8724528 (2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane

AU - Westerveld, W. J.

AU - Leinders, S. M.

AU - Van Neer, P. L.M.J.

AU - Urbach, H. P.

AU - De Jong, N.

AU - Verweij, M. D.

AU - Rottenberg, X.

AU - Rochus, V.

N1 - Conference code: 20th

PY - 2019

Y1 - 2019

N2 - Future applications of ultrasonography in (bio-)medical imaging require ultrasound sensor matrices with small sensitive elements. Promising are opto-mechanical ultrasound sensors (OMUS) based on a silicon photonic ring resonator embedded in a silicon-dioxide acoustical membrane. This work presents new OMUS modelling: acousto-mechanical non-linear FEM and photonic circuit equations. We show that initial wafer stress needs to be considered in the design: the acoustical resonance frequency changes considerably and OMUS sensitivity differs for up-or downwards buckled membranes. Simulated acoustical resonance frequency agrees well with measurements, assuming realistic SOI wafer stress. Measured sensitivity showed large device-to-device variation and simulations agree within this order of magnitude. We conclude that careful modeling of stress is necessary (b) for the design of robust and sensitive sensors.

AB - Future applications of ultrasonography in (bio-)medical imaging require ultrasound sensor matrices with small sensitive elements. Promising are opto-mechanical ultrasound sensors (OMUS) based on a silicon photonic ring resonator embedded in a silicon-dioxide acoustical membrane. This work presents new OMUS modelling: acousto-mechanical non-linear FEM and photonic circuit equations. We show that initial wafer stress needs to be considered in the design: the acoustical resonance frequency changes considerably and OMUS sensitivity differs for up-or downwards buckled membranes. Simulated acoustical resonance frequency agrees well with measurements, assuming realistic SOI wafer stress. Measured sensitivity showed large device-to-device variation and simulations agree within this order of magnitude. We conclude that careful modeling of stress is necessary (b) for the design of robust and sensitive sensors.

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DO - 10.1109/EuroSimE.2019.8724528

M3 - Conference contribution

T3 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019

BT - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019

A2 - van Driel, Willem

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - Piscataway, NJ, USA

T2 - 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019

Y2 - 24 March 2019 through 27 March 2019

ER -

Westerveld WJ, Leinders SM, Van Neer PLMJ , Urbach HP , De Jong N , Verweij MD et al. Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane. In van Driel W, editor, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Piscataway, NJ, USA: Institute of Electrical and Electronics Engineers (IEEE). 2019. 8724528. (2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019). doi: 10.1109/EuroSimE.2019.8724528

Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane

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