Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

Cadmus Yuan; René Kregting; Willem van Driel; Sander Gielen; An Xiao; Guo Qi Zhang

doi:10.4071/isom-2011-TP6-Paper4

Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

Cadmus Yuan, René Kregting, Willem van Driel, Sander Gielen, An Xiao, Guo Qi Zhang

Electronic Components, Technology and Materials

Research output: Contribution to journal › Article › Scientific › peer-review

Abstract

High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven.

Original language	English
Pages (from-to)	418-429
Number of pages	12
Journal	Journal of Microelectronics and Electronic Packaging
Volume	2011
Issue number	1
DOIs	https://doi.org/10.4071/isom-2011-TP6-Paper4
Publication status	Published - 2011

Keywords

RF power packages
ceramic package
plastic high power packages
thermal and mechanical modeling
aluminum wires

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10.4071/isom-2011-TP6-Paper4

Cite this

@article{4821769a594a40c3904c9cfaea198934,

title = "Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging",

abstract = "High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven.",

keywords = "RF power packages, ceramic package, plastic high power packages, thermal and mechanical modeling, aluminum wires",

author = "Cadmus Yuan and Ren{\'e} Kregting and {van Driel}, Willem and Sander Gielen and An Xiao and Zhang, {Guo Qi}",

year = "2011",

doi = "10.4071/isom-2011-TP6-Paper4",

language = "English",

volume = "2011",

pages = "418--429",

journal = "Journal of Microelectronics and Electronic Packaging",

issn = "1551-4897",

publisher = "IMAPS-International Microelectronics and Packaging Society",

number = "1",

}

TY - JOUR

T1 - Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

AU - Yuan, Cadmus

AU - Kregting, René

AU - van Driel, Willem

AU - Gielen, Sander

AU - Xiao, An

AU - Zhang, Guo Qi

PY - 2011

Y1 - 2011

N2 - High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven.

AB - High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven.

KW - RF power packages

KW - ceramic package

KW - plastic high power packages

KW - thermal and mechanical modeling

KW - aluminum wires

UR - http://www.imapsource.org/doi/abs/10.4071/isom-2011-TP6-Paper4?code=imap-site

U2 - 10.4071/isom-2011-TP6-Paper4

DO - 10.4071/isom-2011-TP6-Paper4

M3 - Article

SN - 1551-4897

VL - 2011

SP - 418

EP - 429

JO - Journal of Microelectronics and Electronic Packaging

JF - Journal of Microelectronics and Electronic Packaging

IS - 1

ER -

Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

Abstract

Keywords

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