@inproceedings{6e85dede23f94ae6b3ecb6e350ac0deb,
title = "Packaging induced die stresses considering time-dependent behaviour of a molding compound",
keywords = "ZX Int.klas.verslagjaar < 2002",
author = "JHJ Janssen and G.Q. Zhang and LJ Ernst and MS Kiasat and {et al}, ?",
year = "2001",
language = "Undefined/Unknown",
isbn = "0-7803-9806-8",
publisher = "Europia",
pages = "227--231",
editor = "{LJ Ernst} and {O Saint Leger}, de and {GQ Zhang}",
booktitle = "Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11",
note = "EuroSimE 2001 ; Conference date: 09-04-2001 Through 11-04-2001",
}